| Allicdata Part #: | 260-4TH5E-ND |
| Manufacturer Part#: |
260-4TH5E |
| Price: | $ 6.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | CUP CLIP TRANSISTOR C3488 REV H |
| More Detail: | Heat Sink TO-5 Beryllium Copper Board Level |
| DataSheet: |  260-4TH5E Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 5.78145 |
| Series: | 260 |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-5 |
| Attachment Method: | Bolt On |
| Shape: | Cylindrical |
| Length: | 0.400" (10.16mm) |
| Width: | 0.370" (9.40mm) |
| Diameter: | 0.290" (7.37mm) ID |
| Height Off Base (Height of Fin): | -- |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 14.00°C/W |
| Material: | Beryllium Copper |
| Material Finish: | Black Ebonol |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are a type of passive heat exchanger that research, design, produce and market components that help keep electronic devices cool. The use of effective thermal heat sinks in these applications can help reduce component temperatures and increase component reliability. Heat sinks are used to transfer heat away from components in order to maintain their optimal temperature. This type of component is often crucial for achieving higher performance levels and longer component lifetime.
The 260-4TH5E is a top-of-the-line thermal heat sink with innovative, professionally crafted features. Its specialized construction keeps components running cool, and works especially well in well-ventilated environments where air flow helps remove heat from components more easily. The 260-4TH5E is also highly efficient, able to dissipate heat at a rate of 4W/m2K.
The 260-4TH5E offers a wide range of applications for numerous electronic devices. These devices include CPUs, GPUs, memory cards, graphics cards, I/O boards, and more. Each of these components has its own specific cooling requirements, and the advanced design features of the 260-4TH5E provide reliable solutions.
The 260-4TH5E uses several key principles in order to effectively transfer heat away from components. First, the heat sink uses an extended fin design, which allows for increased surface area, resulting in more efficient heat dissipation from components. By pushing air through the multiple fins, the 260-4TH5E is able to reduce the temperatures of components.
The 260-4TH5E also uses advanced material with optimized thermal properties in order to increase the thermal performance of the heat sink. This material helps reduce the overall thermal resistance, resulting in enhanced heat dissipation. The material used is also highly conductive, allowing for efficient heat transfer from components to the heat sink.
In addition, the 260-4TH5E utilizes an innovative build that helps channel air between components. By increasing air movement around components, the 260-4TH5E helps improve the cooling process while also reducing temperatures. The 260-4TH5E has also been designed with a large-size base, which helps ensure adequate contact between the heat sink and the device.
The 260-4TH5E thermal heat sink is a reliable, high-performance solution for numerous electronic components. Its advanced design features help increase the efficiency of component cooling, resulting in improved performance and extended component lifetime. By utilizing innovative features such as extended fin design, advanced material, and ample air flow, the 260-4TH5E is capable of providing highly effective solutions for keeping components cool.
The specific data is subject to PDF, and the above content is for reference