262-75ABE01 Allicdata Electronics
Allicdata Part #:

345-1084-ND

Manufacturer Part#:

262-75ABE01

Price: $ 0.18
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK VERT/HORIZ BLACK TO-220
More Detail: Heat Sink TO-220 Aluminum 3.0W @ 80°C Board Level,...
DataSheet: 262-75ABE01 datasheet262-75ABE01 Datasheet/PDF
Quantity: 1000
5000 +: $ 0.16035
Stock 1000Can Ship Immediately
$ 0.18
Specifications
Series: 262
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Press Fit and PC Pin
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
Width: 0.570" (14.47mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 3.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 26.70°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks have become increasingly popular for their ability to maintain high performance with minimal range levels. The 262-75ABE01 is a thermal-heat sink designed for power semiconductor applications. It is ideal for connecting varying power transistors and high-current devices together, providing optimal heat dissipation while allowing devices to remain close together without compromising performance. It is a reliable choice for applications with high power levels or in cases where stable temperatures are required.

Application Fields

The 262-75ABE01 is a versatile thermal-heat sink designed for a wide variety of applications. It is suitable for use in applications such as power transistors, high-current devices, home appliances, electric motors, LED lighting, DC-AC converters, or other environments with high power levels and a need for steady temperatures. In addition, the 262-75ABE01 can also be used in automotive and wind turbine applications due to its tolerance for vibrations. Its small size and low profile design make it easy to mount or integrate into an environment, letting it easily fit into any space efficiently.

Working Principle

The 262-75ABE01 uses a combination of conduction and convection cooling to take heat away from the device and dissipate it. By drawing heat away from the device and into the metal fins, the heat spreads quickly over the surface and is then transferred to the atmosphere through air convection. The 262-75ABE01 also includes spring-loaded spacers and metal fins to provide additional stability and direct air flow. These fins allow for better heat transfer and further help move air over the fins to increase the overall cooling effect. This combination of cooling techniques makes for a reliable and effective choice for thermal-heat sink applications.

In conclusion, the 262-75ABE01 is a reliable and cost-effective choice for anyone looking for a thermal-heat sink for their project. Its ability to handle higher power levels, its small form factor, and its robust cooling technologies make it a great solution for applications that need reliable and steady temperatures. Whether it’s a home appliance, a wind turbine, or any other project, the 262-75ABE01 is sure to keep it running smoothly and efficiently.

The specific data is subject to PDF, and the above content is for reference

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