265-118ABHE-22 Allicdata Electronics
Allicdata Part #:

345-1086-ND

Manufacturer Part#:

265-118ABHE-22

Price: $ 0.35
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK VERT ALUM BLACK TO-220
More Detail: Heat Sink TO-220 Aluminum 4.0W @ 56°C Board Level,...
DataSheet: 265-118ABHE-22 datasheet265-118ABHE-22 Datasheet/PDF
Quantity: 1000
2240 +: $ 0.31370
Stock 1000Can Ship Immediately
$ 0.35
Specifications
Series: 265
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 1.180" (29.97mm)
Width: 1.000" (25.40mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 4.0W @ 56°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 14.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are used to support the various types of heat dissipating devices. The 265-118ABHE-22 thermal-heat sink is a high-performance thermal solution for processor-based applications, offering superior performance, ease of installation, and reliability. The 265-118ABHE-22 helps enhance the heat dissipation in your system, providing maximum cooling performance, while minimizing noise levels.
Application Field

The 265-118ABHE-22 thermal-heat sink is designed to be used in environments where maximum cooling and reliability are desired, such as desktop PCs, workstations, servers, laptop computers, or any other system that requires a reliable and efficient thermal solution. The 265-118ABHE-22 features a high-quality aluminum fin construction, which helps to dissipate the heat from the processor quickly and efficiently.

Working Principle

The 265-118ABHE-22 thermal-heat sink works by using a combination of two principles - thermoelectric cooling and thermal spreading. The thermoelectric cooling method makes use of a Peltier module, which is a device that uses electricity to create a heat gradient between two sides. The 265-118ABHE-22 has two Peltier modules integrated into the device; one side transfers the heat from the processor to the other side, which dissipates the heat into the surrounding air. The thermal spreading process acts to spread the heat through the fin construction of the thermal-heat sink, resulting in a more even dissipation of the heat from the processor.

The 265-118ABHE-22 also features an advanced fan design, which helps to further reduce noise levels. The thermal-heat sink is designed with an efficient fin construction and air flow patterns, which helps to reduce air turbulence and noise levels. The precise fin construction is designed to allow for optimized air flow, ensuring maximum cooling performance. The 265-118ABHE-22 also features a low-profile design, which helps to improve the system\'s airflow, resulting in a lower noise level.

Conclusion

The 265-118ABHE-22 thermal-heat sink is an ideal solution for those who need a reliable and efficient cooling solution. The device is designed with a high-quality aluminum fin construction, which helps provide superior cooling performance and reduce noise levels. The advanced fan design and optimized fin construction both help to further improve the cooling performance and reduce noises levels. Together, these features make the 265-118ABHE-22 a highly reliable and reliable thermal solution for processor-based applications.

The specific data is subject to PDF, and the above content is for reference

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