| Allicdata Part #: | 345-1023-ND |
| Manufacturer Part#: |
274-1AB |
| Price: | $ 0.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK TO-220 LOW HEIGHT BLK |
| More Detail: | Heat Sink TO-220 Aluminum 2.0W @ 56°C Board Level |
| DataSheet: |  274-1AB Datasheet/PDF |
| Quantity: | 15929 |
| 1 +: | $ 0.14490 |
| 10 +: | $ 0.13986 |
| 25 +: | $ 0.13306 |
| 50 +: | $ 0.12953 |
| 100 +: | $ 0.12776 |
| 250 +: | $ 0.11899 |
| 500 +: | $ 0.11199 |
| 1000 +: | $ 0.10149 |
| 5000 +: | $ 0.09799 |
| Series: | 274 |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 0.750" (19.05mm) |
| Width: | 0.520" (13.21mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.375" (9.52mm) |
| Power Dissipation @ Temperature Rise: | 2.0W @ 56°C |
| Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | 28.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks
274-1AB is a type of thermal-heat sink, a device used to dissipate heat from heat-generating electronic components. It can be used in applications that require cooling such as computer processors, telecommunications systems, high-power amplifiers, and others.
Heat sinks are composed of two parts: the base and the fins. The base is a solid object used to support the fins, which are metal pieces arranged horizontally in a pattern that provide maximum air flow and heat dissipation. It also has a series of holes, slots, or channels that can be used to attach cooling fans or other cooling devices.
Heat is dissipated from a heat sink by the process of conduction. First, heat is conducted from the electronic component to the base of the heat sink. Then, heat is conducted through the fins of the heat sink, which are made from materials with high thermal conductivity such as aluminum or copper. Finally, the heat is dissipated to the surrounding air through the fins by the process of convection.
The fins of a heat sink can be shaped in a variety of ways to increase the surface area and enhance the heat dissipation. Most heat sinks have a combination of fin designs, including flat fins, wave fins, pin fins, and other variations. The shape of the fins along with the number of fins per inch can both be varied to optimize the heat dissipation.
Heat sinks also need to be designed based on the application they are used in. If the device the heat sink is attached to generates too much heat, then a larger and more efficient heat sink will need to be used. Other factors include the size and shape of the heat sink, the number and size of the fins, and the materials used in the construction.
274-1AB is an industry-standard heat sink that can be used in a variety of applications. It is made from aluminum, has two thin, flat fins, and is designed to dissipate heat quickly and efficiently. It is widely used in computer processors, telecom systems, and other high-power applications.
The specific data is subject to PDF, and the above content is for reference