274-2AB

Series:	274
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-220
Attachment Method:	Bolt On
Shape:	Rectangular, Fins
Length:	0.750" (19.05mm)
Width:	0.520" (13.21mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	2.0W @ 50°C
Thermal Resistance @ Forced Air Flow:	7.00°C/W @ 400 LFM
Thermal Resistance @ Natural:	25.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction

Thermal – Heat Sinks are an important scientific advancement for managing high levels of heat generated within the electronic components of any device. Heat Sinks are designed to extract the heat released from the components and radiate it away from the device. Heat Sinks are used for a variety of electronic components, including diodes, transistors, group transistors, diodes, and integrated circuits. Heat Sinks improve the productivity and reliability of many electronic components and have even been included in some applications to make them smaller and/or to improve the signal quality. The 274-2AB Heat Sink is designed to remove heat from various sources and redistribute it effectively in order to reduce the overall heat generated in the area. It is made from a high-grade aluminum alloy and features a cross-flow fan design to ensure efficient cooling with minimal noise. The 274-2AB Heat Sink is designed for use in a variety of applications, including automotive, medical, industrial, and consumer electronics.

Working Principle

The 274-2 AB Heat Sink utilizes a cross-flow fan to distribute air quickly and evenly over the heatsink\'s fins. As air passes through the fins, heat is removed from the source and dissipated from the heatsink. The fan also helps to remove hot air from the immediate area and ensure a cooler environment. The 274-2 AB Heat Sink also utilizes a convection design to further enhance its heat transfer capabilities. The design of the fins helps to channel air around the unit in order to increase the surface area and effectively disperse heat away from the component and away from the device.

Application Field

The 274-2 AB Heat Sink is designed for a wide variety of applications. Its high-grade aluminum construction and cross-flow fan design makes it capable of handling a variety of temperatures and applications. It is most commonly used in automotive, medical, industrial, and consumer electronics devices due to its efficient heat transfer capabilities and low noise output. In automotive applications, the 274-2 AB Heat Sink is used to dissipate heat from the engine and transmissions, resulting in increased performance and lower fuel consumption. In medical applications, it can be used to cool down equipment and decrease the risk of overheating. In industrial applications, it is used to cool large machinery and equipment, resulting in increased safety and efficiency. In consumer electronics, it is used to cool computer components and other devices, allowing them to perform better and last longer.

Benefits

The 274-2 AB Heat Sink offers a variety of benefits to users. Its high-grade aluminum construction and cross-flow fan design make it one of the most efficient heat sinks on the market. It is capable of dissipating heat quickly and efficiently, resulting in improved performance and increased reliability. It is also designed to be quiet and does not produce any audible noise in most applications. The 274-2 AB Heat Sink also helps to improve the safety and efficiency of any device that utilizes it.

Conclusion

The 274-2 AB Heat Sink is a highly effective and efficient solution for dissipating heat generated by electronic components. Its high-grade aluminum construction and cross-flow fan design make it one of the most efficient solutions on the market. It is capable of dissipating heat quickly and efficiently, resulting in improved performance and increased reliability. It is also designed to be quiet and does not produce any audible noise in most applications. The 274-2 AB Heat Sink is an ideal solution for a variety of applications, including automotive, medical, industrial, and consumer electronics.

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