Series:	--
Packaging:	Bulk
Lead Free Status / RoHS Status:	--
Part Status:	Obsolete
Moisture Sensitivity Level (MSL):	--
Voltage - Clamping:	--
Technology:	Mixed Technology
Number of Circuits:	1
Applications:	General Purpose
Mounting Type:	Rail, Channel
Package / Case:	Module
Supplier Device Package:	--

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

TVS - Mixed Technology

Introduction

A semiconductor package is a single package composed of a number of discrete components and integrated circuits (ICs) that are integrated together, typically on a Printed Circuit Board (PCB). Each component in the package is usually connected to the PCB, and each IC in the package is usually connected to the PCB via so-called "bus bars". These bus bars carry the electrical signals to and from the ICs, and they are generally routed by way of other components in the package, such as capacitors, resistors, coils, or even other ICs. In television and video systems, TVS – mixed technology packages are becoming increasingly popular for designing applications in both industrial and consumer applications. TVS – mixed technology packages can offer a less expensive, faster time-to-market, and higher quality than other solutions available.

Applications and Working Principles

TVS – mixed technology packages are used in a variety of applications, including video and television systems, high-speed data transmission systems, and portable electronic devices. They offer advantages over traditional assemblies such as a lower cost, more reduced board space, and a simpler assembly process.The most common type of TVS – mixed technology package is the 3-Way Board-level Multi-chip Package (BMC). The 3-Way BMC is a combination of two or more small devices (such as memory chips, processors, etc.) that can be integrated into a single package on a PCB. A BMC is typically manufactured using surface-mount technology and a special bonding material.In a 3-Way BMC, the components are usually connected to each other via two different types of bus bars – bus bars with a "star" type formation, and bus bars with a "loop" type formation. The star type bus bars are used for high-speed signals, while the loop type bus bars are used for lower speed signals. The star and loop type bus bars, when connected together, form a "mesh" type of bus structure, which allows the signals from the two different devices to be transmitted over a single bus.The design and layout of the bus-bar structure is an important consideration in the design of a 3-Way BMC. The arrangement of the bus bar structure will depend on the type of signals that need to be transmitted, the speed at which the signals need to be transmitted, and the type of package being used. For example, if the speed of the signals is very high, then a complex bus bar structure, comprising multiple loops and stars, may be required to maximize the data-transmission capacity of the bus bar.

Conclusion

TVS – Mixed Technology packages offer several advantages in certain industrial and consumer applications. These packages are cheaper than traditional assemblies, occupy lesser board space, and are more straightforward to assemble. The type and arrangement of the bus-bar in a 3-Way BMC package are two important considerations that will affect the overall performance of the package.

The specific data is subject to PDF, and the above content is for reference

Part Number	Manufacturer	Price	Quantity	Description