| Allicdata Part #: | 345-1025-ND |
| Manufacturer Part#: |
291-H36AB |
| Price: | $ 0.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK TO-220 BOLT-ON BLK |
| More Detail: | Heat Sink TO-220 Aluminum 2.0W @ 68°C Board Level |
| DataSheet: |  291-H36AB Datasheet/PDF |
| Quantity: | 6256 |
| 1 +: | $ 0.35910 |
| 10 +: | $ 0.34335 |
| 25 +: | $ 0.32634 |
| 50 +: | $ 0.31777 |
| 100 +: | $ 0.31355 |
| 250 +: | $ 0.29207 |
| 500 +: | $ 0.27488 |
| 1000 +: | $ 0.24912 |
| 5000 +: | $ 0.24052 |
| Series: | 291 |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 0.860" (21.84mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.360" (9.14mm) |
| Power Dissipation @ Temperature Rise: | 2.0W @ 68°C |
| Thermal Resistance @ Forced Air Flow: | 16.00°C/W @ 600 LFM |
| Thermal Resistance @ Natural: | 34.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat sinks are devices that absorb and dissipate thermal energy produced by electronic components, protecting them from damage due to overheating. The 291-H36AB is a specialized heat sink designed to increase the thermal efficiency of a variety of electronic components. It is designed with a unique internal structure that offers superior thermal performance, increased air flow, and excellent heat dissipation. Read on to learn more about the working principle and application field of the 291-H36AB.
The 291-H36AB heat sink is constructed from aluminum alloy with a unique internal construction that optimizes its thermal performance. The design features a clever die-casting structure in which many internal fins are evenly distributed through the heat sink, maximizing air flow while minimizing air leakage. The centrally located heat pipe further improves thermal performance, transferring heat away from the electronic components and out of the device. The fins are coated with a special thermal paste, allowing for efficient thermal management.
The increased air flow achieved by the 291-H36AB heat sink ensures that the device operates with optimal thermal performance, even in situations with higher ambient temperatures. It is also designed to ensure a low pressure drop, allowing for efficient operation. The 291-H36AB also features an integrated ventilation system, helping to reduce the formation of hot spots and preventing components from overheating. The device also features anti-vibration technology, ensuring that it remains silent during operation.
The 291-H36AB heat sink can be used to cool a variety of different electronic components, including CPUs, GPUs, memory modules, graphics cards, and other high-performance components. It is also suitable for use with server and networking hardware, providing reliable thermal performance in demanding applications. The heat sink can also be used in industrial applications such as robotics and automated manufacturing. The 291-H36AB is particularly well-suited for applications with high temperatures, such as automotive and aerospace, due to its excellent thermal efficiency and durability.
The 291-H36AB heat sink is an excellent choice for a wide range of applications, offering superior thermal performance and reliable operation. With its clever design and innovative features, it offers reliable cooling solutions for a variety of electronic components and industrial applications. Its ability to increase air flow, reduce hot spots, and minimize noise makes it an ideal choice for high-performance applications.
The specific data is subject to PDF, and the above content is for reference