2CM77P1001-1-H Allicdata Electronics
Allicdata Part #:

S3117-ND

Manufacturer Part#:

2CM77P1001-1-H

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Sullins Connector Solutions
Short Description: CONN HEADER HM C SHIELDED 77POS
More Detail: 77 (55 + 22 Ground) Position Header, Male Pins Con...
DataSheet: 2CM77P1001-1-H datasheet2CM77P1001-1-H Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Connector Type: Header, Male Pins
Connector Style: C 11
Number of Positions: 77 (55 + 22 Ground)
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5 + 2
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: CompactPCI
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1A
Voltage Rating: --
Operating Temperature: -65°C ~ 125°C
Features: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane Connectors, also known as “connectors” or “interface connectors”, are used in a variety of applications where electrical connection between different elements of a system is necessary. Backplane Connectors come in a number of different types, each with its own set of features and benefits. The two main types of Backplane Connectors are Hard Metric and Standard.

2CM77P1001-1-H falls under the Hard Metric category of Backplane Connectors. This connector is primarily used in high speed applications requiring data rates up to 20 Gbps. It has a mated height of 1.25mm, which gives it a higher level of reliability than its standard counterparts. It is specifically designed for high speed and data intensive applications. This makes it ideal for deep-packet applications as well as high-speed communication systems, such as routers, switches, and storage devices.

In terms of application field, 2CM77P1001-1-H is primarily used in military/aerospace, telecom, industrial automation, and semiconductor applications. It is designed for applications in which extremely high connector density is essential, such as in modular servers. In addition, it is also suitable for use in high-power DC data communication systems, since its contact system is designed to reduce signal loss and interference.

The working principle of 2CM77P1001-1-H Backplane Connector is based on the principle of wave Solder Technology. This technology allows the connector to be connected securely and stably in a high-density environment. The contact system is designed to ensure maximum performance and reliability. It consists of three layers of contacts: an inner layer of conductive metal contacts, a middle layer of insulation material, and an outer layer of conductive metal contacts.

The inner and outer layers of contacts are connected via soldering, while the middle layer of insulation material insulates the inner and outer layers of contacts. This design ensures maximum reliability and stability, since the contact system is protected from electromagnetic interference and shock. The insulation material also helps to reduce the amount of power lost as the data is transferred from one layer of contacts to another.

In addition to the contact system, the 2CM77P1001-1-H connector also features an integrated lock mechanism. This locking mechanism ensures that the connector stays securely locked in place, even under conditions of mechanical shock or vibration. The locking mechanism is designed to be easy to use and to provide secure attachment even under harsh applications.

In conclusion, the 2CM77P1001-1-H Backplane Connector is an ideal solution for applications requiring high speed and/or data intensive applications. Its contact system is designed to reduce signal loss and interference, while its locking mechanism ensures secure attachment. It is an excellent choice for modular servers, high-power DC data communication systems, and other applications requiring high connector density.

The specific data is subject to PDF, and the above content is for reference

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