| Allicdata Part #: | 3-1542004-0-ND |
| Manufacturer Part#: |
3-1542004-0 |
| Price: | $ 7.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | TE Connectivity AMP Connectors |
| Short Description: | HTS736-U=27MM HS ASSY A-TEMP C |
| More Detail: | Heat Sink |
| DataSheet: | 3-1542004-0 Datasheet/PDF |
| Quantity: | 1000 |
| 250 +: | $ 7.03521 |
Specifications
| Series: | * |
| Part Status: | Active |
Description
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Thermal - Heat Sinks
Thermal - heat sinks are commonly used to cool electronics and household appliances, but they are also widely used in chemical processes, robotics, compressors, motors and other industrial applications. Thermal - heat sinks are important components in many electronic and electrical products, as they draw away heat away from sensitive components and ensure that the device can maintain efficient and reliable operations.A thermal - heat sink is an electrical device that dissipates heat away from components such as an electrical short-circuit or an electrical component over-heating. It typically consists of a body with fins or ridges that increases surface area and helps with convection cooling. Thermal - heat sinks are typically constructed of metal, plastic, aluminum, or copper.In the 3-1542004-0 application field and working principle, thermal - heat sinks are used to efficiently transfer heat away from sensitive electrical components such as integrated circuits and active components. A thermal - heat sink uses a combination of convection and radiation to dissipate the heat. Radiation is direct heat transfer from the source, while convection involves the air currents that move around the thermal - heat sink and carry away the heat.The 3-1542004-0 thermal - heat sink also uses the natural force of gravity for efficient cooling. This works by a fan or fanless design, which forces air to flow around the fins of the thermal heat sink. The fins of the thermal - heat sink is designed to collect maximum heat exchanged from the device, which is then dissipated by the air forced through the thermal - heat sink.Heat transfer is improved by a number of factors, such as the type of material used in the thermal - heat sink, the design of the thermal - heat sink, the form factor, and the number of heat transfer surfaces. The materials used to construct the thermal - heat sink will determine the amount of heat that can be dissipated as well as the rate of heat transfer. The design of the thermal - heat sink is also important, as this determines the surface area and the way the air flows around the thermal heat sink.The form factor is also important as it needs to fit the device that the thermal - heat sink will be attached to. It has to fit into the given space available and be able to provide efficient cooling. The form factor will also determine the number of heat transfer surfaces that can be used. Finally, the type of fans used in the thermal - heat sink will determine the amount of air that can flow through it as well as its overall cooling efficiency.The 3-1542004-0 application field and working principle can provide long-lasting cooling to components that require it. Thermal - heat sinks help to prevent overheating of components and sustain the device’s performance. Thermal - heat sinks also help to reduce energy consumption, as excess heat is dissipated away more quickly. This helps to improve efficiency and allows for other processes to be run in a more efficient manner.The specific data is subject to PDF, and the above content is for reference
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3-1542004-0 Datasheet/PDF