3-1542005-7 Allicdata Electronics
Allicdata Part #:

3-1542005-7-ND

Manufacturer Part#:

3-1542005-7

Price: $ 6.94
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: 25MM HS ASSY ULTEM CL
More Detail: Heat Sink
DataSheet: 3-1542005-7 datasheet3-1542005-7 Datasheet/PDF
Quantity: 1000
350 +: $ 6.24078
Stock 1000Can Ship Immediately
$ 6.94
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks is a type of device designed to control the temperature of electronic components to prevent overheating and thus extend the life of the device. 3-1542005-7 is a specific type of Thermal - Heat Sink that is designed for cooling applications in electronic components such as CPUs, GPUs, and memory chips.

Thermal - Heat Sinks works by taking heat away from electronic components and dissipating it into the surrounding environment. The Heat Sink consists of a metallic-based structure and several fins allowing for a high level of thermal performance. Heat is drawn away by the fins, and then dissipates into the air surrounding the Heat Sink due to convection. Heat Sinks are designed to provide maximum cooling efficiency and are typically constructed using aluminum, copper, or other heat conductive material to maximize heat transfer.

The 3-1542005-7 Thermal - Heat Sink utilizes a metal-based structure and fins to move heat from electronics components and dissipate it into the environment. The Heat Sink is designed with a high-surface-area structure that increases the speed of heat dissipation and efficiency, and a low-profile design that improves the clearance around components. The Heat Sink also utilizes a fan to help drive air through its fins and further increase heat dissipation. The fan can also be adjusted or removed based on the application’s specific needs.

The 3-1542005-7 Heat Sink is designed for cooling applications in electronic components such as CPUs, GPUs, and memory chips. The Heat Sink is designed for efficient heat transfer and optimal cooling performance, making it an ideal choice for use in processor-intensive applications such as gaming, multimedia, and overclocking. The Heat Sink is also suitable for use in smaller devices such as tablets and smartphones, where space is limited and optimal cooling performance is necessary. The Heat Sink is compatible with many third-party cooling solutions, which makes it an ideal choice for custom cooling solutions as well.

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The 3-1542005-7 Thermal - Heat Sink is designed for use in a variety of applications and is an ideal solution for cooling electronics components. The Heat Sink’s metal-based structure and fins provide maximum cooling efficiency, while its fan-driven cooling helps further increase heat dissipation. The Heat Sink is compatible with many third-party cooling solutions, making it an ideal choice for custom solutions. With its high-performance design, the 3-1542005-7 Heat Sink is an ideal choice for cooling applications in electronic components such as CPUs, GPUs, and memory chips.

The specific data is subject to PDF, and the above content is for reference

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