335214B00032G Allicdata Electronics
Allicdata Part #:

335214B00032G-ND

Manufacturer Part#:

335214B00032G

Price: $ 1.15
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BGA HEAT SINK
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: 335214B00032G datasheet335214B00032G Datasheet/PDF
Quantity: 1000
1800 +: $ 1.03440
Stock 1000Can Ship Immediately
$ 1.15
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 0.985" (25.02mm)
Width: 0.985" (25.02mm)
Diameter: --
Height Off Base (Height of Fin): 0.390" (9.91mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

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Thermal - Heat Sinks
335214B00032G is a simple and cost effective heat sink widely used in electronic systems totransfer heat and improve heat dissipation efficiency. It has a long-term thermallyconductive aluminum base with a die cast magnesium alloy fan frame, attached to a robusttop-down fan with a bulletproof engineering plastic frame for durability in harshenvironments. It provides a reliable air and heat flow system.
This heat sink supports a variety of applications, such as low-power DC/DC converters,motor drives, automotive modules, PCB-like LED lighting modules, digital products such asphones, tablets, and consumer electronics. It reduces heat balance problems due to itssemi-flush mounting solution and can efficiently dissipate heat from high temperaturedevices.
The 335214B00032G heat sink uses forced convection cooling to improve the overallperformance and results of electronic applications. It creates a flow of air in a rigiddirection directed towards the heat applied components. It works on principles of fluidmechanics, using Bernoulli\'s equation to convert air pressure into velocities. This pressuredifferential allows air to naturally flow to the hot spots, allowing the hot air to circulateand for cooler air to fill the void. This allows for efficient heat dissipation, allowingelectronic products to last longer.
The 335214B00032G heat sink also features an internal dust cover to protect the componentsfrom dirt, very thorough fin geometry for maximum active area, and multiple mounting solutionsfor increased versatility. It also uses high-quality copper tubing for maximum thermalconductivity and evenly distributed airflow to its surface areas. Additionally, it is FCCapproved and has a one-year warranty for reliability and user satisfaction.
Overall, the 335214B00032G heat sink is designed for optimal heat dissipation in a widearray of electronic applications. It is easy to install, made with durable materials, andpromotes efficient cooling of heat-generating electronic components. This ensures the longevityof electronic products and prevents overheating, reducing the need for frequent maintenanceand repair.

The specific data is subject to PDF, and the above content is for reference

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