342940 Allicdata Electronics
Allicdata Part #:

HS477-ND

Manufacturer Part#:

342940

Price: $ 17.21
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: COPPER HEATSINK 38.5X37.6X14MM
More Detail: Heat Sink BGA Copper Top Mount
DataSheet: 342940 datasheet342940 Datasheet/PDF
Quantity: 156
1 +: $ 15.64920
10 +: $ 14.77980
25 +: $ 13.91040
50 +: $ 13.04100
100 +: $ 12.17160
250 +: $ 11.30220
500 +: $ 11.08490
Stock 156Can Ship Immediately
$ 17.21
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.480" (37.59mm)
Width: 1.516" (38.50mm)
Diameter: --
Height Off Base (Height of Fin): 0.551" (14.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.90°C/W
Material: Copper
Material Finish: AavSHIELD 3C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical to the operation and longevity of any electronic device. Heat sinks are a type of passive heat-dissipation device that uses a combination of air flow, physical shape, and thermal conductivity to dissipate heat away from a device. In a typical application, thermal energy is dissipated from the device via a thermal interface material, such as a thermal pad, thermal gel, or thermal compound. The thermal material is then in contact with the heat sink, allowing the heat sink to absorb the thermal energy generated by the device. The heat sink then disperses the energy into the environment via convection and/or radiation, thus helping to maintain a device\'s optimal temperature range.

The 342940 is an all aluminum heat sink with ribs and pins to improve the thermal transfer from the device to the surface of the heat sink. The surface of the heat sink has a special coating that helps to increase the amount of heat transfer. The principal behind this is that when the cold air hits the fins of the 342940, it imparts thermal energy onto the surface, allowing for maximum heat dissipation.

The 342940 is designed for both vertical and horizontally mounted electronics. The design of the heat sink ensures that the heat is dissipated in the most efficient manner possible, regardless of the orientation of the device. The 32mm height and 39mm overall length make the 342940 a compact and efficient way to dissipate thermal energy from electronics.

The 342940 is an optimized heat sink that provides superior thermal performance in a wide variety of applications. It has a very low thermal resistance, meaning it transfers more energy to the environment quickly and efficiently. The surface of the heat sink has a special coating, improving the thermal transfer rate, making it ideal for many applications. The heat sink can be used in multiple orientations, providing efficient thermal dissipation regardless of the orientation of the device.

When compared to other heat sinks of a similar size, the 342940 stands out due to its superior thermal performance. With its unique design, the 342940 is designed to provide maximum cooling performance in a variety of applications. Whether the application is dissipation of thermal energy from an LED, a CPU, or other electronics device, the 342940 will provide superior cooling performance that other similar products cannot match.

The 342940 is a great choice for any application that requires high performance, low thermal resistance, and ease of installation. With its compact size and superior cooling performance, the 342940 is the ideal heat sink to use for any application that requires efficient cooling.

The specific data is subject to PDF, and the above content is for reference

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