342941

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.594" (40.50mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.531" (13.49mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	13.30°C/W
Material:	Copper
Material Finish:	AavSHIELD 3C

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Thermal Heat SinksThermal heat sinks are one of the most important components of many electronic systems. They are designed to be used in applications where heat dissipation is a priority. Thermal heat sinks are typically made from heat-conductive materials such as aluminum and copper and are often mounted directly onto the component being cooled.The primary purpose of a thermal heat sink is to absorb heat from its surroundings and transfer it away from the component while also preventing the component from overheating. Heat sinks use conduction to conduct the heat absorbed from the component away from it in the form of either air or liquid cooling. Heat dissipation usually occurs in two stages: convection and radiation.In convection, the heat sink absorbs and transfers heat away by moving it away from the component and up into the atmosphere. Heat dissipating components are typically designed to move the heat to a higher altitude where it can disperse more effectively. Radiation is where the thermal heat sink absorbs heat emitted from the surface of the component and conducts it away from the component. This type of heat dissipation may be used to cool components that generate a lot of heat.There are various shapes, sizes, and materials that can be used for thermal heat sinks. Aluminum and copper are the two most popular materials used for heat sinks. Aluminum, due to its good thermal conductivity, is typically used to dissipate lower amounts of heat. Copper is used when higher amounts of heat need to be dissipated as it has better conduction qualities than aluminum.The most popular shapes used for thermal heat sinks are the square, round, and octagonal shapes. Smaller heat sinks typically use a round shape and large heat sinks use the square or octagonal shapes. When dealing with compact components, a smaller shape such as the octagonal shape is often used as it can be placed in tighter areas. When dealing with large components, the square or octagonal shapes are used as they can better dissipate the heat from the component and away from it.In conclusion, thermal heat sinks are extremely important components in many electronic systems, as they are designed to absorb, transfer, and dissipate heat away from components. They are typically made from heat-conductive materials such as aluminum and copper and are mounted onto the component to be cooled. Heat dissipates by either convection or radiation and various shapes, sizes, and materials can be used depending on the amount of heat that needs to be dissipated.

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