3893-0050

Series:	389
Packaging:	Bulk
Part Status:	Obsolete
Connector Type:	Stacking Compression
Number of Positions:	150
Pitch:	0.050" (1.27mm)
Number of Rows:	4
Mounting Type:	Surface Pressure with Screw Lock
Features:	--
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)
Mated Stacking Heights:	--
Height Above Board:	0.343" (8.70mm)

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3893-0050 Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

The 3893-0050 series rectangular connector from TE Connectivity, part of the Array, Edge Type, Mezzanine (Board to Board) series of connectors, are a board-to-board interconnect system designed with an array of holes that snap-lock onto the substrate allowing the connector to be mounted and de-mounted multiple times over its expected lifespan. This high density 2mm SMT system brings maximum flexibility with two levels of stacking from 1.75mm and 5mm by guiding the board alignment. This allows for more space within the electronic device, making it more compact. The 3893-0050 design also features 90° of angular orientation, allowing greater flexibility in the integration of these components and making them suitable for a wide range of applications.

The 3893-0050 series is well-suited for applications ranging from automotive, medical, and telecommunication to the industrial and military markets. The overall design allows these connectors to handle high speed signals and high current between the connected boards. Separate power and signal contact layers have been integrated into the design to allow for increased dome board we use and improved EMC electrical performance. A vacuum pick-up feature has been added to ensure that the connectors are properly aligned for optimal performance.

The assembly process for this connector series is relatively simple, only requiring the basic soldering of two components. The connectors fit into an SMT hole and are anchored into a plated-through hole for a secure connection. The mating is accomplished by soldering a number of solder pins into the plated-through hole via a pick and place machine. The two-level board-to-board connection is complete with the soldered board-to-board connection of the two connectors.

The 3893-0050 series of connectors offer a high level of performance with a range of features designed for enhanced reliability, such as contact protection design, shock and vibration connection designs, and vibration resistant solder joint design. The contacts themselves are zoned into pinvanes, allowing maximum signal integrity with a minimum of cross talk. The series also features power and signal contact layers which are integrated into each connector for reduced dome board we use and improved EMC electrical performance. These features make the series well-suited for a wide variety of harsh environments and applications where reliable connections are necessary.

The 3893-0050 series of connectors also boasts a range of other features, such as a wide range of product availability, wide variety of material and processes, multiple mounting and mating options, assembly and mounting flexibility, a robust design for use in a wide temperature range of up to 1000V DC, and a high-volume production capability. This makes the series ideal for applications where size, robustness, and performance are critical.

In conclusion, the 3893-0050 series of connectors from TE Connectivity offers a wide range of features and benefits for optimal performance in a variety of applications. From its two-level board-to-board connection to its flexible mounting and mating options, the connector series is designed for reliable performance in a wide range of environments and conditions. Additionally, the wide range of product availability, wide variety of material and processes, and high-volume production capability make this connector series suitable for a variety of applications where size, robustness, and performance are critical.

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