3D70DEV-100

Series:	--
Part Status:	Active
Type:	Display
Function:	LCD Touch Screen
Embedded:	--
Utilized IC / Part:	3D70
Primary Attributes:	7" 800x480 WVGA
Supplied Contents:	Board(s), Cable(s)
Secondary Attributes:	Graphical User Interface, RS-232 and USB Interfaces

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Introduction

The 3D70DEV-100 Evaluation and Demonstration Boards and Kits are designed to allow engineers and researchers to evaluate, prototype, and develop advanced mathematical and signal processing applications in three-dimensional Digital Signal Processing (DSP) architectures. This article will provide an overview of the application field and working principle of the 3D70DEV-100.

Application Field

The 3D70DEV-100 is used for the development and evaluation of high-performance audio, image and data processing algorithms for use in consumer applications. Examples of applications that can be developed with the 3D70DEV-100 include audio signal processing in home theaters, room correction and equalization, noise reduction, image processing, scientific signal processing, navigation and communication, and data transmission applications.The 3D70DEV-100 kit offers an easy-to-use, comprehensive environment for rapid prototyping and algorithm development. The kit includes the hardware components necessary to construct a functional 3-D DSP system, and the development software allows users to develop their parameters and algorithms.The 3D70DEV-100 is also an ideal platform for testing new 3-D DSP algorithms. It provides a versatile platform for running tests of algorithms using real-time simulations. The platform can be used to measure the performance of novel 3-D algorithms using a variety of metric including throughput, latency, resource utilization, and quality of service.

Working Principle

The 3D70DEV-100 system is based on a distributed architecture. This means that the 3-D DSP processing core is made up of multiple processing nodes, each dedicated to a specific task. This architecture enables the system to perform operations in parallel, greatly increasing the performance.Each node in the 3-D DSP processing core is made up of a processor, programming interface, and a block of memory. To create a three-dimensional signal processing system, the nodes are logically connected to each other by a network fabric. The nodes communicate using packet-based protocol, which allows them to exchange data quickly and efficiently. This enables the system to process and route data in parallel, resulting in increased throughput.The 3D70DEV-100 development system includes two main software tools, the "Designer" and the "Cruncher". The Designer is used to create the 3-D DSP program, while the Cruncher is used to compile the code and generate the machine code used by the processor nodes.The Designer allows users to create the parameters and algorithms necessary to create a 3-D DSP program. The parameters can be adjusted to trade off performance and resource utilization. The data flow for the program can also be modified, allowing for more efficient data flow.Once a program has been created, the Cruncher compiles it into executable machine code. This code is then loaded onto the processor nodes, which execute the program in real time.

Conclusion

The 3D70DEV-100 Evaluation and Demonstration Boards and Kits offer a comprehensive environment for quickly developing and evaluating advanced 3-D DSP algorithms. This platform gives users the tools necessary to create their own 3-D DSP algorithms and parameters, and then test them in real time. Additionally, the distributed architecture of the platform increases the performance of algorithms by allowing them to run in parallel.

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