4-1542012-0 Allicdata Electronics
Allicdata Part #:

4-1542012-0-ND

Manufacturer Part#:

4-1542012-0

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: 29MM PIN FIN HS ASSEMBLY
More Detail: Heat Sink
DataSheet: 4-1542012-0 datasheet4-1542012-0 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: *
Part Status: Obsolete
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks 4-1542012-0 Application Field and Working Principle

Thermal - heat sinks are components that work together with other thermal products, such as heat sources, heat exchangers, and cooling fans, to dissipate heat and spread thermal energy across larger surface area. Such components not only reduce the temperature of the components they are attached to, but also serve to increase their overall efficiency. The 4-1542012-0 heat sink is a particularly useful model with a wide range of application in testing and prototyping fields. The 4-1542012-0 heat sink is a type of passive heat sink, as it does not require any external power. This design utilizes a pin fin of internal heat dissipation structure and a base plate of externally heat dissipation structure to effectively transfer heat away from the component. It works on the principle that the fan directs the air to pass through the pin fin, drawing heat away from the component and dissipating it to the outside environment. The base plate presents a higher area to volume ratio which increases the overall temperature.The 4-1542012-0 can be used within a variety of scenarios. Its small size and light weight makes it ideal for use in electronic prototyping and product testing. It can also help improve the temperature management of small, compact products while reducing their overall operating costs. Additionally, the heat sink’s pins also provide increased passive air flow, helping to reduce component temperatures. It can also be used in long-term cases, such as in medical settings, to cool down medical imaging equipment.The benefits of the 4-1542012-0 model are numerous, ranging from improved efficiency and reduced operational costs to increased passive air flow. The heat sink’s small size and light weight allows it to be used in various testing applications, such as for prototypes, without sacrificing performance. Its pins provide increased air flow to reduce component temperatures, and its base plate gives a higher area to volume ratio. All of these features make the 4-1542012-0 an excellent choice for a high-performing heat sink.

The specific data is subject to PDF, and the above content is for reference

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