4131PA51G01180

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Efficiently reducing radio frequency interference (RFI) and electromagnetic interference (EMI) is an important factor in achieving successful electronic system design. The 4131PA51G01180 is part of the RFI and EMI Contacts, Fingerstock and Gaskets product group. It is designed to provide shielding in electronic systems, protecting them from EMI and RFI fields.

The 4131PA51G01180 is a precision-engineered, all metal contact that is constructed from a high-quality sheath and a gold-plated contact area. It has a low-profile form factor, and it is designed to slip easily into an existing chassis. It has a force actuation of less than 0.001 ounces and a contact resistance of less than one milliohm. The contact area is protected from wear due to the anodizing process, which increases the durability and reliability of the contact.

The 4131PA51G01180 is designed to reduce EMI and RFI radiation in several ways. First, by providing shielding from external sources, it reduces the transmission of EMI and RFI fields to the protected circuit. Second, when coupled with shielding built into the customer’s electronic system, the contact reduces the propagation of interference signals to other electronic systems or other sensitive areas. Third, the contact\'s low-profile design reduces the susceptibility of the contact to external interference due to its small surface area.

The design of the 4131PA51G01180 conforms to stringent standards and has been tested in a variety of operating conditions. This ensures that the contact will provide the desired shielding performance in the customer’s application. The contact is designed for use in a wide array of applications, including commercial and military applications that require shielding from EMI and RFI fields. It is also suitable for other applications that require shielding such as ground planes, antenna couplers, and RF cables.

The 4131PA51G01180 is designed to meet the specific needs of customers who require superior shielding and electrical contacts. Its versatile design, superior shielding performance, low-profile form factor, and superior contact resistance make it an ideal solution for providing shielding from EMI and RFI fields in a wide variety of applications.

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