4184PA51G00591 Allicdata Electronics
Allicdata Part #:

4184PA51G00591-ND

Manufacturer Part#:

4184PA51G00591

Price: $ 0.76
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: GK NICU NRSG PU V0 DSH
More Detail: N/A
DataSheet: 4184PA51G00591 datasheet4184PA51G00591 Datasheet/PDF
Quantity: 1000
341 +: $ 0.69472
Stock 1000Can Ship Immediately
$ 0.76
Specifications
Series: --
Part Status: Active
Type: Fabric Over Foam
Shape: D-Shape
Width: 0.150" (3.80mm)
Length: 5.910" (150.11mm)
Height: 0.059" (1.50mm)
Material: --
Plating: --
Plating - Thickness: --
Attachment Method: Adhesive
Operating Temperature: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RFI and EMI - Contacts, Fingerstock and Gaskets

The number 4184PA51G00591 is associated with a line of products for RF and EMI applications. The product line consists of contacts, fingerstock and gaskets that are designed to provide both electrically conductive and thermally conductive paths between two contacting surfaces. They are often utilized in enclosed electronics and communication equipment in order to protect sensitive components from Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI).

Applications of 4184PA51G00591

The 4184PA51G00591 product line is designed for a wide range of applications that require both electrical and thermal properties. Its components are used in electronic assemblies to provide protection from EMI/RFI, such as in computers and computer peripherals, telecommunications equipment, medical equipment, military equipment, and automotive applications. The 4184PA51G00591 components are also ideal for use in commercial and industrial applications where high levels of performance are needed in order to achieve optimal performance.

Working Principle of 4184PA51G00591

The 4184PA51G00591 product line is designed with an integrated bonding system consisting of three components – contacts, fingerstock and gaskets. The contact component is made up of two substrates, which act as the hub for the EMI/RFI protective shield. The contacts are then interlinked by special bonding layers which form the resistance paths. Once in contact, the contacts form a unified shielding network that is capable of providing both electrical and thermal conduction between two contacting surfaces. In addition, the fingerstock component provides a retentive force to ensure the integrity of the shield is maintained, while the gaskets further improve the secure assembly.

The materials used to make the 4184PA51G00591 components can vary depending on the application. They are often made of copper, alloy or stainless steel in order to provide a highly resilient electrical and thermal path that can withstand high temperatures. They are also dielectric in nature, which means they are nonconductive and can block electrical signals. Finally, the components are also capable of providing protection against EMI and RFI, which can prevent unwanted interference with digital signals.

Conclusion

The 4184PA51G00591 product line provides a range of RF and EMI components that are designed to provide both electrically conductive and thermally conductive shielding paths between two contacting surfaces. They are suitable for a variety of applications that require protection against interference, providing a reliable and secure assembly with a unified shielding network. The contacts, fingerstock and gaskets come in a variety of materials, allowing for custom-tailored solutions that are tailored to the specific needs of each application.

The specific data is subject to PDF, and the above content is for reference

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