Allicdata Part #: | 4202PA51H00050-ND |
Manufacturer Part#: |
4202PA51H00050 |
Price: | $ 0.07 |
Product Category: | RF/IF and RFID |
Manufacturer: | Laird Technologies EMI |
Short Description: | GK NICU PTAFG PU V0 DSH |
More Detail: | N/A |
DataSheet: | 4202PA51H00050 Datasheet/PDF |
Quantity: | 1000 |
2902 +: | $ 0.05999 |
Series: | -- |
Part Status: | Active |
Type: | Fabric Over Foam |
Shape: | D-Shape |
Width: | 0.252" (6.40mm) |
Length: | 0.500" (12.70mm) |
Height: | 0.118" (3.00mm) |
Material: | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) |
Plating: | -- |
Plating - Thickness: | -- |
Attachment Method: | Adhesive |
Operating Temperature: | -- |
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The 4202PA51H00050 is a contact, fingerstock, and gasket that helps manage radio frequency interference (RFI) and electromagnetic interference (EMI). It is designed for a wide range of applications, and its working principle is defined by its structure and construction.
The 4202PA51H00050 comprises of a molded silicone rubber substrate. This substrate includes an integral contact member, or fingerstock, and is embedded with an array of electrical contacts that are arranged in a stair-step pattern. This fingerstock is the outermost layer of the assembly. The fingerstock is constructed using stainless steel and has a height of 1/8 inch. It also contains an array of gaps that allow air to easily travel through the fingerstock and dissipate heat away from the contact area.
The contact member of the fingerstock helps to electrically connect the substrates and their associated electronic components. The conductive fingerstock also serves as a low-impedance shield against the passage of RF and EM signals between substrates. It also helps to reduce the intensity of the signal, and directs the RF and EM energy away from the component. The contact member can be set to provide a high contact pressure between the substrates. This ensures that there is a complete electrical connection and minimal RF and EM leakage.
The 4202PA51H00050 also includes a molded silicone rubber gasket. This gasket helps to physically and electrically bond the substrates and their associated components together. The gasket is designed to fill in the air gaps between the contacts, thus forming a barrier between them and reducing RF and EM leakage. The gasket is also able to dissipate heat away from the contact area, thus protecting the components from any damage due to excess heat.
In addition to the fingerstock and gasket, the 4202PA51H00050 also includes an aluminum backing plate. This plate is designed to provide an extra layer of protection against RF and EM signals. It is also able to dissipate heat away from the contact area. The aluminum backing plate is corrosion-resistant and provides added insulation against electrical noise.
The 4202PA51H00050 is a versatile and effective solution for RFI and EMI, and is suitable for a wide range of applications. Its structure and construction ensure that it offers a strong, reliable connection between components, and its various components provide superior protection against RF and EM radiation. In addition, the aluminum backing plate ensures that the contact and fingerstock stay in place at all times, and that electrical and RF signals are effectively dissipated.
The specific data is subject to PDF, and the above content is for reference
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