4209PA51H01200 RF/IF and RFID |
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Allicdata Part #: | 4209PA51H01200-ND |
Manufacturer Part#: |
4209PA51H01200 |
Price: | $ 1.74 |
Product Category: | RF/IF and RFID |
Manufacturer: | Laird Technologies EMI |
Short Description: | GK NICU PTAFG PU V0 REC |
More Detail: | N/A |
DataSheet: | 4209PA51H01200 Datasheet/PDF |
Quantity: | 1000 |
158 +: | $ 1.57468 |
Series: | -- |
Part Status: | Active |
Type: | Fabric Over Foam |
Shape: | Rectangle |
Width: | 0.154" (3.90mm) |
Length: | 12.000" (304.80mm) |
Height: | 0.118" (3.00mm) |
Material: | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) |
Plating: | -- |
Plating - Thickness: | -- |
Attachment Method: | Adhesive |
Operating Temperature: | -- |
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RFI and EMI- Contacts, Fingestock and Gaskets are used in a wide range of electrical assemblies, such as communication systems, frequency control systems and electronic equipment. The application field and working principle of 4209PA51H01200 have been discussed in this article.
The 4209PA51H01200 is a contact and fingerstock material designed to provide a quality interface between equipment surfaces in radio frequency interference or electro-magnetic interference (RFI/EMI) applications. The desirable properties of the material include high resistance to thermal shock, low dielectric loss, low water absorption, high conductivity and consistent electrical characteristics. It is specifically designed to meet the RFI/EMI shielding requirements for equipment that require shielding to be provided as a protective barrier from the outside environment.
The material is a 5-layer, corrosion-resistant metal plus polymeric film composite keypad contact. The keypad contact comprises of an upper aluminum foil, one or two layer middle stainless steel layer and one or two layer of bottom polymeric film. The material also includes fingerstock fingerstock material and gasket material. The fingerstock and gasket material have different characteristics in terms of dielectric loss, thermal shock resistance, water absorption and conductivity.
The material provides excellent shielding against electro-magnetic interference (EMI). The keypad contacts are designed to have high electrical resistance and good shielding. The resistance of the contact material depends on the material used and the design of the contact. The fingerstock and gasket material provide excellent performance with respect to thermal shock resistance, low water absorption, high conductivity and low dielectric loss. The material also provides low capacitance and good impedance characteristics.
The material is used in a wide range of applications requiring good shielding against RFI/EMI. It is used in mobile phones, RFID tags, satellite antennas and other related applications where shielding is necessary. The material is also used in power lines, power systems and other related applications where electrical shielding is required. It is used in equipment such as TV’s, computers and radios.
The working principle of the 4209PA51H01200 contact material is based on the electrical and mechanical properties of the metal and polymeric film. The metal layer provides a high electrical resistance to prevent conduction of electrical signals and provides an excellent shielding of radio frequency interference/electrical interference. The polymeric film provides a low dielectric loss and thermal shock resistance. The material also provides a good impedance characteristics, which prevents any interference from external sources. The material also provides a low capacitance and good insulation.
In conclusion, the 4209PA51H01200 contact material plays an important part in the RFI/EMI shielding of electrical and mechanical assemblies. It is designed to meet the demands of shielding in applications where a high-quality interface is necessary. This material provides excellent thermal shock resistances, low water absorption, high conductivity and consistent electrical characteristics. It also provides a low capacitance and good impedance characteristics. All these properties make 4209PA51H01200 a superior choice for RFI/EMI shielding applications.
The specific data is subject to PDF, and the above content is for reference
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