447095-4 Allicdata Electronics
Allicdata Part #:

447095-4-ND

Manufacturer Part#:

447095-4

Price: $ 91.51
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: COAX PIN CONTACT, SZ 1
More Detail: Contact Gold Coaxial Pin RG-393 Crimp
DataSheet: 447095-4 datasheet447095-4 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
100 +: $ 83.19430
Stock 1000Can Ship Immediately
$ 91.51
Specifications
Series: Coaxicon
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Type: Coaxial
Pin or Socket: Pin
Contact Termination: Crimp
Wire Gauge: RG-393
Contact Finish: Gold
Contact Finish Thickness: 50.0µin (1.27µm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 447095-4 backplane connector is an interconnecting component in the transmission of digital data in electronic systems. These connectors use a four-layer stackup board to provide stack contact power points for many simultaneous data paths. It is a high-charge device and able to transfer high speed data signals up to 10 Gbps, with a total capacity of 40 W per contact.

Application Field

The 447095-4 backplane connector is typically used in high-speed computing systems such as server and storage systems, routers, and other high-speed data access and analysis applications. It is designed to support data transmission at fast and reliable speeds, reducing latency and increasing efficiency. This type of backplane connector is also used in paperless copying machines, printing machines, digital production lines, and other high-speed data processing and data access applications.

Working Principle

The 447095-4 backplane connector is designed to transfer fast digital data signals from a host device to multiple external devices. It utilizes a four-layer stackup board and a series of power points for each of the simultaneous data paths. Each layer is isolated from the other layers by a plug in the core of the board. The four-layer stackup board consists of two outer and two inner layers. The outer layers serve as the signal lines, while the inner layers contain the power points. The power points are arranged in a grid configuration, allowing for multiple data channels to exist simultaneously.The 447095-4 backplane connector is constructed with two structures: a signal line contact and a power point contact. The signal line contact consists of metal pins that make contact with the signal lines, while the power point contact is made of high conductive spring contacts that make contact with the power points. Both of these structures are enclosed in a connector body that provides mechanical protection to the signal lines and power points. When the 447095-4 backplane connector is operational, the metal pins of the signal line contact and the high conductive spring contacts of the power point contact will make contact with their respective structures, allowing for data to pass through. Additionally, the four-layer stackup board will provide power to the power points so that data transmission can occur at the highest transmission rates possible.

Conclusion

The 447095-4 backplane connector is a multipurpose interconnecting component used to facilitate the rapid data transfer between various high-speed computing and data access systems. It utilizes a four-layer stackup board to provide simultaneous data paths and power points for data transmission. Additionally, the connector is constructed with two different structures, a signal line contact and a power point contact, which provide mechanical protection to the structures and allow for data transfers at high speeds. The 447095-4 connector is essential for digital data transmission in high-speed computing systems and data access applications. With its high-speed transmission capabilities and robust construction, the 447095-4 connector proves to be invaluable in high-performance environments.

The specific data is subject to PDF, and the above content is for reference

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