
Allicdata Part #: | 4688PA51H03600-ND |
Manufacturer Part#: |
4688PA51H03600 |
Price: | $ 4.28 |
Product Category: | RF/IF and RFID |
Manufacturer: | Laird Technologies EMI |
Short Description: | GK NICU PTAFG PU V0 REC |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
59 +: | $ 3.88539 |
Specifications
Series: | -- |
Part Status: | Active |
Type: | Fabric Over Foam |
Shape: | Rectangle |
Width: | 0.118" (3.00mm) |
Length: | 36.000" (914.40mm) |
Height: | 0.079" (2.00mm) |
Material: | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) |
Plating: | -- |
Plating - Thickness: | -- |
Attachment Method: | Adhesive |
Operating Temperature: | -- |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 4688PA51H03600 Contact, Fingerstock and Gaskets are designed to reduce both the spectrum of RFI and EMI. They are designed to form an RF-tight interface in order to reduce the escape of RF signals. These contacts are made of continuous beryllium copper, allowing excellent mechanical properties with low electrical contact resistance. This contact is designed to fit most tight tolerance board mounting configurations and to offer maximum board-to-board spacing. The fingerstock is provided in various sizes to accommodate different board fill applications. Gaskets are made of high performance polymer material for maximum gap and RFI sealing capability.The 4688PA51H03600 Contact, Fingerstock and Gaskets are highly reliable solutions for both RFI and EMI protection. The contact is made of continuous beryllium copper, making it ideal for HF and VHF frequencies. The contact ensures tight contact fit, low electrical contact resistance, high current carrying capacity and excellent high temperature mechanical resistance. The fingerstocks offer excellent board to board spacing and have various sizes to accommodate different board geometries and applications. In addition, the gaskets are made of high performance polymer material resulting in maximum gap and RFI sealing capability.The working principle of the 4688PA51H03600 Contact, Fingerstock and Gaskets is quite straightforward and simple. The contact and fingerstock provide electrical conductivity between two boards, while the gasket seals the gap between them, thus preventing the escape of RF signals. The contact and fingerstock also ensure tight contact fit, low electrical contact resistance and high current carrying capacity. This ensures maximum electrical and thermal stability.Overall, 4688PA51H03600 Contact, Fingerstock and Gaskets are an ideal choice for RFI and EMI protection. They provide excellent board to board spacing, low electrical contact resistance and excellent thermal stability. Moreover, the gaskets ensure maximum gap and RFI sealing capability. As such, they are essential components for any electronic assembly.The specific data is subject to PDF, and the above content is for reference
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