4695PA51H01000 RF/IF and RFID

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RFI and EMI Contacts, Fingerstock and Gaskets.

The 4695PA51H01000 is an engineered contact that is designed to meet the requirements of both RFI and EMI shielding applications. This engineered contact utilizes the current Fingerstock technology, with a thermally stable and conductive gasket material to provide superior shielding. Both the contact fingerstock and the gasket material are constructed from a high-density polytetrafluoroethylene (PTFE) and designed in a special shape to ensure proper contact with the gasket material.

RFI and EMI shielding contacts provide electrical coupling of an electrical component to a metallic shield. These engineered contacts provide a low-impedance connection between the device and the shield to ensure appropriate signal transfer and low cross-talk. The contact fingerstock is precisely manufactured to ensure proper alignment between the contact and the shield. The gasket material is designed to provide both electrical coupling and mechanical stability.

The 4695PA51H01000 contact fingerstock is designed to provide superior electrical performance. It is constructed from a high-density PTFE material to ensure a low-resistance connection and to provide superior low-impedance shielding. The contact fingerstock is designed in a special shape to ensure proper contact with the gasket material, which is designed to provide thermally stable and conductive shielding.

The thermally-stable and conductive gasket material used in the 4695PA51H01000 is designed to provide superior electrical and mechanical performance. The gasket is constructed from a specially processed, high-density PTFE material to ensure a thermal bond between the contact fingerstock and the shield. The gasket material is designed to provide superior electrical and mechanical performance, ensuring a low-resistance connection to the shield and providing low-impedance shielding.

The 4695PA51H01000 contact is designed to provide superior signal transfer and low cross-talk between the device and the shield, ensuring proper operation in RFI and EMI applications. The contact fingerstock and the gasket material are constructed from a high-density PTFE material and designed in a special shape to ensure proper contact between the device and the shield. The thermally-stable gasket material provides superior electrical and mechanical performance, ensuring a low-resistance connection and providing low-impedance shielding.

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