4J54EA51N00650 RF/IF and RFID

RFI and EMI - Contacts, Fingerstock and Gaskets

RFI and EMI contacts, fingerstock and gaskets provide a highly reliable solution for users requiring good electromagnetic interference (EMI) and Radio Frequency Interference (RFI) protection. The products safeguard circuit boards from EMI and RFI contamination and also provide an effective barrier for protecting against environmental extremes such as dirt, dust and moisture ingress from the outside environment.4J54EA51N00650 is a particular type of RFI and EMI contact material. It is a bonded sheet material that is laminated onto a dielectric sheet such as ethylene-propylene, a thermoplastic elastomer. 4J54EA51N00650 is often used on circuit boards and in applications where reliable EMI and RFI shielding is required. It is commonly employed in military, aerospace and cellular radio applications. 4J54EA51N00650 has excellent shielding effectiveness; providing greater than previously available nickel-based contacts. The material provides up to 75 dB of attenuation at 1 GHz and up to 130 dB at 10 GHz. The material is also very compliant, meaning it can be used on a wide range of components and circuit boards with different shapes and thickness. The low contact resistance allows for the material to perform consistently even in high current applications. The material also offers excellent temperature stability and is suitable for temperatures ranging from -40°C to +125°C.4J54EA51N00650 contacts, fingerstock and gaskets are typically used in a snap fit-type application. To install the contacts, the material is laminated directly to a dielectric sheet, such as ethylene-propylene. The dielectric sheet acts as a spacer and provides the necessary electrical insulation required for shielding the electrical components from EMI or RFI. The material is then cut to size and the contacts are mechanically attached to the dielectric sheet. The edges of the contact are then wrapped around the edges of the dielectric sheet and the edges are crimped for a better fit and electrical contact. This process provides an electrical bond between the contact and the dielectric sheet and creates a reliable EMI and RFI shield.The material can also be used in compression types of applications, such as edge connections. This process involves placing the material between two layers of dielectric sheets and then placing a press on top. The fingerstock is then compressed between the two sheets, creating the electrical contact between the two layers. This type of application provides superior shielding effectiveness while still maintaining a low contact resistance. 4J54EA51N00650 contacts, fingerstock and gaskets are ideal for applications that require reliable EMI and RFI shielding. The material is highly compliant, providing an excellent fit and reliable electrical contact even in high current applications. The low contact resistance allows for good performance even in extreme environmental conditions such as extreme temperatures, dirt and dust ingress, and moisture ingress. The material also offers superior shielding effectiveness, providing up to 75 dB of attenuation at 1 GHz and up to 130 dB at 10 GHz.