| Allicdata Part #: | A115307-ND |
| Manufacturer Part#: |
5-1542004-7 |
| Price: | $ 9.53 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | TE Connectivity AMP Connectors |
| Short Description: | 23MM HS ASSY A-TEMP C |
| More Detail: | Heat Sink |
| DataSheet: | 5-1542004-7 Datasheet/PDF |
| Quantity: | 1000 |
| 400 +: | $ 8.58312 |
| Series: | * |
| Part Status: | Active |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are incredibly important in many modern technological and industrial applications. As their name implies, they are designed to dissipate heat, created by machines and other electrical components. 5-1542004-7 heat sinks provide high-quality performance, stemming from a combination of intricate design, engineering, and craftsmanship.
Application Field
Heat sinks are extremely important for machines that generate large amounts of heat, such as CPUs, GPUs, and integrated circuits, as these electronics must have a reliable and effective way of dissipating the heat away from the sensitive components. 5-1542004-7 heat sinks can be used to effectively dissipate this generated heat, ensuring that the thermal properties of the device are within satisfactory levels. It can also be used in applications which involve large DC current, such as power supplies, where large amounts of heat need to be dissipated quickly. Additionally, 5-1542004-7 heat sinks can be used in medical applications, such as motor-driven medical instruments, laser therapeutic equipment, and high voltage current medical devices.
Working Principle
5-1542004-7 heat sinks use a method called thermochemical bonding to achieve highly efficient heat dissipation. This process involves using a combination of copper and aluminium. Firstly, copper is used to create a copper base, using high temperature brazing technology. Secondly, aluminium is used to attach the copper core to the heat sink cooling fins, creating a superior thermal bond between the two materials. This bond is more efficient at dissipating heat than traditional thermal adhesive, providing superior results. The heat sink is then mounted onto the thermal source, which allows the system to work quickly and efficiently.
Conclusion
5-1542004-7 heat sinks provide excellent thermal management and cooling performance. They are suitable for applications such as CPUs, GPUs, integrated circuits, power supplies, and motor-driven medical instruments. The heat sink is constructed of a combination of copper and aluminium, using thermochemical bonding to ensure superior heat dissipation. It is then mounted onto the thermal source, which allows the system to manage heat quickly and efficiently.
The specific data is subject to PDF, and the above content is for reference
5-1542004-7 Datasheet/PDF