50015-1128GLF Allicdata Electronics
Allicdata Part #:

50015-1128GLF-ND

Manufacturer Part#:

50015-1128GLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN HEADER 4 ROW VERT SOLDER
More Detail: N/A
DataSheet: 50015-1128GLF datasheet50015-1128GLF Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
0 +: $ 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 32
Voltage Rating: --
Operating Temperature: --
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Mating Guide
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Through Hole
Series: HPC™
Number of Rows: 4
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 128
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Header, Male Pins
Connector Usage: Daughtercard
Moisture Sensitivity Level (MSL): --
Part Status: Preliminary
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

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50015-1128GLF backplane connectors are specialty connectors widely used in today’s electronics industry for connecting circuits on printed circuit boards. These have been designed to meet specific backplane application requirements where space is limited and miniaturization is paramount. Backplane connectors are primarily used in mobile or laptop applications, where form factor is a critical factor for the device.

50015-1128GLF backplane connectors are used in applications where a reliable and secure connection between the circuit boards is required. It is capable of providing up to 72 circuits per connector in extremely tight form factors. The contact system is designed for low contact resistance and can be used in applications up to 10A. This connector is also capable of withstanding 10,000 mating cycles and is able to function in temperatures ranging from -40°C to +125°C.

The 50015-1128GLF backplane connector is keyed for mating orientation. The contact system consists of individual socket contacts that are arranged symmetrically along a ground plane layer within the connector. Except for the permanent contact, each contact is spring-loaded, which provides a reliable and secure connection between mating parts.

The pin-out of the 50015-1128GLF backplane connector is designed for low impedance and cross talk. The connector itself is made from an engineered thermoplastic material, which is highly resistant to many corrosive and damaging effects of environment. This material helps reduce vibration and prevents acoustic noise, which is important in sensitive applications. The 100-size version of the 50015-1128GLF can fit in 0.5mm pitch applications.

The working principle of the 50015-1128GLF backplane connector is relatively simple but highly effective. It employs a standard insertion and mating system, which features a unique wedge locking mechanism to ensure secure mating. This mechanism is purely mechanical and does not require the use of an auxiliary locking system. The wedge locking feature prevents accidental disengagement due to vibrations and temperature changes.

Once the two halves of the connector are mated, the spring-loaded contacts quickly meet and mate. The contacts are made from high quality beryllium copper, which provides a reliable and secure connection between the two halves of the connector. The spring type contact systems also serve to reduce the potential for electrical arcing, which is an important safety precaution.

The 50015-1128GLF backplane connector is quickly becoming the standard choice for many backplane applications. Its reliable performance, low contact resistance, secure mating system and small form factor make it one of the most sought after specialty connectors available today. By allowing for the miniaturization of complex electronic circuits, these connectors are helping to push the limits of what can be achieved in the world of electronics.

The specific data is subject to PDF, and the above content is for reference

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