50015-1192D Allicdata Electronics
Allicdata Part #:

50015-1192D-ND

Manufacturer Part#:

50015-1192D

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: 4 ROW VERTICAL HEADER SOLDER
More Detail: N/A
DataSheet: 50015-1192D datasheet50015-1192D Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 48
Voltage Rating: --
Operating Temperature: --
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Mating Guide
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Through Hole
Series: HPC™
Number of Rows: 4
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 192
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Header, Male Pins
Connector Usage: Daughtercard
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to Backplane Connectors - SpecializedBackplane Connectors - Specialized are essential components in circuit boards design. They are characterized by their high-speed signal transmission and record levels of current conduction. The 50015-1192D is one such connector, a specialized backplane connector featuring a shallow length contact field. It is designed for use in specific applications and offers superior levels of signal integrity and current rating. In this article, we will delve further into the details of the 50015-1192D specifically its application fields and working principle.Application Fields of the 50015-1192DThe 50015-1192D is designed for specific applications that require both power and signal transmission in an integrated system. Some of the applications the 50015-1192D has been put to include:•AI/ML powered vehicles•High-speed connections in datacenters•Data collection/ transmission in industrial and medical devices•Backplanes in embedded systems•Test setups in laboratoriesThe vast array of applications for this connector is due in part to its high current rating of 6A and its low profile design. The 50015-1192D has been designed in compliance to certain standards such as UL2003 and CSA22.2 No. 210-1978-03, evidencing its superior quality.Working Principle of the 50015-1192DThe 50015-1192D backplane connector works on the principle of magnetic force. It features four pre-tinned contacts arranged horizontally spaced at ninety degrees from each other. The contacts feature a shielded design to ensure protection from electric and radio waves, enabling them to conduct signals over long distances whilst maintaining high levels of signal integrity and data transmission rates. The 50015-1192D also features superior levels of current conduction and power delivery due to its high rating as mentioned. This rating is possible due to the utilization of cold plated, gold plated contacts. Furthermore, the 50015-1192D features an environmental rating of -25 degrees celsius to +85 degrees Celsius making it suitable for a wide range of applications.ConclusionThe 50015-1192D is a versatile backplane connector designed to meet the needs of specific applications which require both power and signal transmission in an integrated system. It has a high current rating of 6A and a low profile design. It is also compliant with most international standards ensuring its quality. The 50015-1192D works on the principle of magnetic interaction through four pre-tinned contacts arranged horizontally spaced at ninety degrees from each other. Its features enable it to deliver high signal integrity and data transmission rates, making it suitable for use in AI/ML powered vehicles, high-speed connections in datacenters, data collection/transmission in industrial and medical devices, backplanes in embedded systems, and test setups in laboratories.

The specific data is subject to PDF, and the above content is for reference

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