501200B00000G Allicdata Electronics
Allicdata Part #:

HS227-ND

Manufacturer Part#:

501200B00000G

Price: $ 0.48
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK 14-16 DIP BLACK .19"
More Detail: Heat Sink 14-DIP and 16-DIP Aluminum 0.4W @ 30°C T...
DataSheet: 501200B00000G datasheet501200B00000G Datasheet/PDF
Quantity: 16300
1 +: $ 0.42840
10 +: $ 0.40950
25 +: $ 0.38909
50 +: $ 0.37876
100 +: $ 0.37365
250 +: $ 0.34809
500 +: $ 0.32760
1000 +: $ 0.29689
5000 +: $ 0.28665
Stock 16300Can Ship Immediately
$ 0.48
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: 14-DIP and 16-DIP
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Rectangular, Fins
Length: 0.250" (6.35mm)
Width: 0.731" (18.57mm)
Diameter: --
Height Off Base (Height of Fin): 0.190" (4.83mm)
Power Dissipation @ Temperature Rise: 0.4W @ 30°C
Thermal Resistance @ Forced Air Flow: 50.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 68.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are designed to conduct, transfer, and dissipate heat away from heat-producing components. They are particular useful for applications that process large amounts of data and run demanding applications. The 501200B00000G is a thermal heat sink used to manage temperatures generated from demanding applications. This article will discuss the application field and working principle of the 501200B00000G.

The 501200B00000G is designed for use in multiple environments, from home offices to commercial environments. It is suitable for use in various server applications and works to efficiently manage temperatures within the environment. It is also suitable for use in other high-power applications such as semiconductor, FPGA, and ASIC designs. The 501200B00000G provides superior cooling performance with a compact size that allows for easy integration into existing systems.

The 501200B00000G features a copper base and aluminum fins that are designed for optimal transmission of heat. The copper base ensures good thermal conductivity which helps the heat sink to spread the heat generated from a component fast and efficiently. Additionally, the aluminum fins aid in heat dissipation, drawing the heat away from the important internal components and allowing it to be dissipated into the surrounding environment.

Furthermore, the 501200B00000G is designed with a heat spreader which helps to extend the life of the component from which the heat is generated. The heat spreader is effective in proportionally spreading the heat and allowing it to be dissipated more effectively. In addition, the 501200B00000G also has a fan that helps to further improve its cooling efficiency.

The 501200B00000G contains a number of features that make it an ideal thermal heat sink. Its efficient design helps to effectively transfer, dissipate, and manage heat from demanding applications. Additionally, the copper base and aluminum fins provide superior heat transfer and dissipation capabilities. Finally, the heat spreader and fan work in concert to further enhance its cooling efficiency. These features and capabilities make the 501200B00000G an ideal solution for managing temperatures in various applications.

The specific data is subject to PDF, and the above content is for reference

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