Allicdata Part #: | 505403B00000G-ND |
Manufacturer Part#: |
505403B00000G |
Price: | $ 1.34 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEATSINK TO-3 H31.75MM |
More Detail: | Heat Sink TO-3 Aluminum 7.0W @ 40°C Board Level |
DataSheet: | 505403B00000G Datasheet/PDF |
Quantity: | 2476 |
1 +: | $ 1.22220 |
10 +: | $ 1.19007 |
25 +: | $ 1.15794 |
50 +: | $ 1.09355 |
100 +: | $ 1.02917 |
250 +: | $ 0.96486 |
500 +: | $ 0.93269 |
1000 +: | $ 0.83620 |
5000 +: | $ 0.82012 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-3 |
Attachment Method: | Bolt On |
Shape: | Square, Pin Fins |
Length: | 1.780" (45.21mm) |
Width: | 1.780" (45.21mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.250" (31.75mm) |
Power Dissipation @ Temperature Rise: | 7.0W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 1.50°C/W @ 600 LFM |
Thermal Resistance @ Natural: | 6.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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505403B00000G is a type of thermal - heat sink, which is commonly used in many applications. It is designed to provide efficient cooling for electronic components and systems. This thermal - heat sink uses the principle of convection, which is based on the transfer of heat from a hot surface to an adjacent cooler surface.
The 505403B00000G is composed of a base plate, a number of heat-dissipating fins, and a fan. The base plate is made from aluminum or copper, and serves as a heat sink. It absorbs heat from the system and dissipates it to the finned surfaces. The fins are constructed from either aluminum or copper. They are designed to increase the surface area and heat transfer rate between the base plate and the ambient air.
The fan is mounted on the base plate of the thermal - heat sink to further increase the convection rate by forcing air across the surface of the heat sink fins. By actively drawing air away from the fins, the fan helps to keep them cool. This helps to reduce the temperature of the system, and in turn, increases its efficiency.
The 505403B00000G is a very versatile type of thermal - heat sink. It can be used in a wide variety of applications including power supplies, cooling systems, server farms, and medical equipment. This type of heat sink can be used in applications where standard air cooling is not feasible, such as high power electronic components and systems. It is also the preferred choice for applications where operation is carried out in harsh environments, such as exposed to dust, heat, or vibration.
The 505403B00000G is easy to install and maintenance-free for most applications. It is constructed from durable materials, which ensure it is able to withstand various temperature extremes and environmental conditions, as well as providing a long service life. In addition, it is generally a very cost-effective solution for cooling electronic components and systems.
In summary, the 505403B00000G is a type of thermal - heat sink, which is designed to provide efficient cooling for electronic components and systems. It uses convection to efficiently dissipate heat, and a fan may be added to further enhance its cooling capability. This type of thermal - heat sink is versatile, easy to install, and maintenance-free, making it an ideal choice for cooling a variety of components and systems.
The specific data is subject to PDF, and the above content is for reference
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