506003B01300 Allicdata Electronics
Allicdata Part #:

506003B01300-ND

Manufacturer Part#:

506003B01300

Price: $ 1.40
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-3 Aluminum 16.0W @ 90°C Board Level
DataSheet: 506003B01300 datasheet506003B01300 Datasheet/PDF
Quantity: 1000
3500 +: $ 1.26290
Stock 1000Can Ship Immediately
$ 1.4
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-3
Attachment Method: Bolt On and Board Mounts
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Width: 1.750" (44.45mm)
Diameter: --
Height Off Base (Height of Fin): 0.375" (9.52mm)
Power Dissipation @ Temperature Rise: 16.0W @ 90°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The 506003B01300 is a component of an electrical system and has a variety of applications in the industrial, aviation, and consumer markets. It works as a specialized heat sink, designed to keep temperatures stable and to distribute heated air away from vital elements or enclosures. It is most commonly used in applications where heat needs to be dissipated quickly such as computers, lasers, and other electronic devices.

Working Principle

The 506003B01300 is designed to absorb and dissipate heat from the internal components of electronic devices. It does this by using a base of aluminum or other heat-conductive material that quickly absorbs heat from the internal components and then distributes it away from the source in order to keep temperatures stable and protect sensitive electrical components. The base material has either fins or ridges to increase the surface area and help to efficiently dissipate the heat into the surrounding environment.

The 506003B01300 is designed to maintain a constant temperature, thereby helping to prevent overheating and associated problems such as component failures or system shutdowns. It is also designed to reduce noise levels by dissipating heat away from the source.

Applications

The 506003B01300 is used in a wide variety of applications as a heat sink that dissipates heat away from sensitive components and enclosures. It is used in computers, lasers, and other electronic devices where heat needs to be dissipated quickly and efficiently. It is also used in consumer and industrial electronics, including telecommunications, automotive, and medical equipment.

In the aviation industry, the 506003B01300 is used as a heat sink for cooling avionics systems in airplanes. It helps to keep temperatures stable and prevents the overheating of vital components in the system. In the industrial sector, it is used in industrial robots, HVAC systems, and other electrical systems where heat needs to be dissipated quickly and efficiently.

Benefits

The 506003B01300 offers a number of benefits in a variety of applications. It is designed to reduce the amount of heat generated inside a system, thereby reducing the risk of component failure or system shutdowns. It is also designed to reduce noise levels by dissipating heat away from the source. Additionally, it is designed to be lightweight and highly efficient, as well as to be resistant to corrosion and environmental conditions.

In addition to the benefits of the 506003B01300 in terms of heat management, it also helps to protect sensitive components from the environment. The aluminum or other heat-conductive material helps to dissipate heat away from the source and keeps temperatures stable, which helps to reduce the risk of component failure.

The 506003B01300 is an essential component in many industrial, consumer, and aviation applications. It is designed to keep temperatures stable and efficiently dissipate heat away from the source, thereby protecting vital components and reducing the risk of failure or system shutdowns. It is lightweight, highly efficient, and resistant to environmental conditions, making it an ideal solution for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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