| Allicdata Part #: | 345-1197-ND |
| Manufacturer Part#: |
510-3M |
| Price: | $ 40.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK FOR PWR MOD/IGBT/RELAY |
| More Detail: | Heat Sink Power Modules Aluminum Top Mount |
| DataSheet: | 510-3M Datasheet/PDF |
| Quantity: | 38 |
| 1 +: | $ 36.76680 |
| 10 +: | $ 34.60460 |
| 25 +: | $ 32.44170 |
| 50 +: | $ 30.27890 |
| 100 +: | $ 29.19760 |
| Series: | 510 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Power Modules |
| Attachment Method: | Adhesive |
| Shape: | Rectangular, Fins |
| Length: | 3.000" (76.20mm) |
| Width: | 7.380" (187.45mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 3.106" (78.89mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.56°C/W |
| Material: | Aluminum |
| Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are devices that are used for cooling electrical components. They are designed to dissipate heat generated by the component into the surrounding air, which in turn absorbs the heat and dissipates it. Heat sinks are typically constructed of metal, such as aluminum or copper, but can also be made of different materials, such as ceramic, plastic, or even silicone. They come in various shapes and sizes, from small to large. Heat sinks are often used in computers, laptops, and other electronic devices that generate a lot of heat. They are also used to cool high-power components like CPUs and GPUs.
The 510-3M is a type of thermal-heat sink, specifically designed to have a large thermal resistance and improved cooling efficiency. It is made of a lightweight material, such as aluminum, and has a large fan mounted on top for cooling. The fan is larger than traditional fans, so it can move a greater volume of air. The 510-3M is also designed with a special fin design that increases its cooling performance. The fins are designed to increase turbulence in the incoming air, allowing for better cooling and heat dissipation. The 510-3M also has a unique design, with a curved edge and ribbed structure on the surface that helps to direct airflow in the desired direction.
When a device needs cooling, the 510-3M can be attached to the heated component. As the fan accelerates the airflow over the fins, the heat from the component transfers to the fins and dissipates into the surrounding air. This helps to keep the component from overheating and ensures it can work safely and efficiently. The fan and fins work together to create a cooling air current that is directed away from the component, effectively cooling the component.
The 510-3M is a great choice for cooling electronics, as it is highly efficient and has a large fan that helps to quickly dissipate the heat. It has a low profile design, is lightweight, and is easy to install and maintain. The 510-3M is also relatively inexpensive, making it a great solution for those on a budget. With its superior cooling performance and lightweight design, the 510-3M is an excellent choice for cooling electronic components.
The specific data is subject to PDF, and the above content is for reference
510-3M Datasheet/PDF