510-6M Allicdata Electronics
Allicdata Part #:

345-1199-ND

Manufacturer Part#:

510-6M

Price: $ 53.94
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK FOR PWR MOD/IGBT/RELAY
More Detail: Heat Sink Power Modules Aluminum Top Mount
DataSheet: 510-6M datasheet510-6M Datasheet/PDF
Quantity: 109
1 +: $ 49.03920
10 +: $ 45.97610
25 +: $ 42.91080
50 +: $ 41.37830
100 +: $ 39.84570
Stock 109Can Ship Immediately
$ 53.94
Specifications
Series: 510
Part Status: Active
Type: Top Mount
Package Cooled: Power Modules
Attachment Method: Adhesive
Shape: Rectangular, Fins
Length: 6.000" (152.40mm)
Width: 7.380" (187.45mm)
Diameter: --
Height Off Base (Height of Fin): 3.106" (78.89mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 0.38°C/W
Material: Aluminum
Material Finish: --
Description

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510-6M Application Field and Working Principle

The 510-6M thermal heat sink is a thermal management device that mobilizes heat energy from electronic components like processors, amplifiers, and transistors. It is a form of mitigation to suppress excessive temperature rise in higher powered electronic components, and is essential for protecting against component failure and de-tuning. This device can also be used for heat dissipation at dissipative temperatures powers where flow of air is difficult.

The heat sink is an enclosure designed to conduct and release heat quickly and efficiently, and acts as a buffer between components that heat up and the cooler environment. The materials used in the construction of the sink must be chosen carefully to optimize its heat dispersal and transfer. Some of the commonly used materials for this purpose include aluminum, copper, or a combination of both.

The 510-6M thermal heat sink operates in two primary modes: convection and conduction. In the convection mode, heat is dissipated through the use of fans and airflow, while conduction ensures that heat is dissipated through solid surface contact with a sink or heat spreader made of aluminum or copper. Heat conduction is more effective when using a combination of both materials.

Depending on its particular application, the 510-6M can come with either passive cooling or an active cooling system. Passive cooling is suitable when the heated components are in closed spaces and require only moderate cooling, while active cooling is more effective for components operating at higher temperatures.

The active cooling system uses heat sinks with fans and other components, such as heatpipes, to transfer the heated air away from the components. Heatpipes are long, circular metallic tubes filled with a heat transfer liquid that efficiently utilizes air for additional cooling. Fans are also used to move the heated air away from the heated component. This system is much more effective than passive cooling, but also more costly.

The 510-6M thermal heat sink utilizes air for its cooling purposes, so the air should be clear of dust and other particles that could prevent the airflow from cooling the components. The air inside the system should also be circulating constantly to ensure the most efficient cooling. The temperature of the air should also be monitored to make sure it’s not too hot and prevent component failure.

Aside from its application in temperature controlling electronic components, the 510-6M can also be used in other fields. For instance, it can be used in metalworking and plastic injection moulding to manage the heated part during extrusion. It can also be used in medical devices and laser equipment to protect components from overheating.

In summary, the 510-6M thermal heat sink is a versatile device used for managing heat from electronic components and other purposes. It uses either passive cooling or active cooling to regulate the temperature, depending on the application. The active cooling system is more effective but more expensive, so its usage should be limited. Additionally, the air inside the system should be kept dust-free and must be circulating for the best possible cooling effect.

The specific data is subject to PDF, and the above content is for reference

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