| Allicdata Part #: | 345-1201-ND |
| Manufacturer Part#: |
510-9M |
| Price: | $ 74.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK FOR PWR MOD/IGBT/RELAY |
| More Detail: | Heat Sink Power Modules Aluminum Top Mount |
| DataSheet: |  510-9M Datasheet/PDF |
| Quantity: | 25 |
| 1 +: | $ 67.86360 |
| 10 +: | $ 63.62370 |
| 25 +: | $ 59.38200 |
| 50 +: | $ 57.26130 |
| 100 +: | $ 55.14050 |
| Series: | 510 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Power Modules |
| Attachment Method: | Adhesive |
| Shape: | Rectangular, Fins |
| Length: | 9.000" (228.60mm) |
| Width: | 7.380" (187.45mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 3.106" (78.89mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.29°C/W |
| Material: | Aluminum |
| Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal Heat Sinks are critical components in a wide range of applications. They are commonly used to dissipate heat generated from microelectronic components, computers and other electronic devices. The 510-9M Heat Sink is a thermally effective heat transfer material, manufactured from durable aluminum alloy and CNC milled to provide a flat surface area and optimized heat conducting capacity. It is designed for use in tight spaces and has a high heat elimination capacity.
The 510-9M Heat Sink works by dissipating heat away through convective, radiative, and conductive means. In convective heat transfer, the hot air generated by the device is replaced by air that is cooler. This type of transfer is most common in fan-equipped systems, but can also be achieved with a passive system. Radiative heat transfer occurs when electromagnetic radiation is released from the device being cooled. This type of energy can travel through the air and transfer heat to the heat sink. Lastly, conductive heat transfer takes place when two objects with different temperatures come in contact with each other. When the device being cooled exchanges energy with the heat sink, the heat is dissipated.
The 510-9M Heat Sink is effective in a wide variety of applications, including server and gaming systems, high-power LED applications, x86-based workstations, power supplies, and other low-profile applications where space is limited. It is designed to work with larger CPU heatsinks and is capable of dissipating high levels of heat quickly and safely. Additionally, its lightweight construction ensures it is easy to install and can be integrated without significant changes to the existing system.
The 510-9M Heat Sink also offers good thermal resistance, making it suitable for use in cooling tightly enclosed components that can’t be easily accessed. It is designed to be mounted using screws and a steel mounting bracket, which allows for easy removal and reassembly. The heat sink also provides a high level of performance, with a thermal resistance of 0.08 degrees Celsius per watt. It is also very efficient at dissipating heat, reaching a maximum of 45W.
The 510-9M Heat Sink is an effective solution for controlling thermal management in a variety of applications. It is designed for easy installation and offers high performance and thermal resistance. Additionally, it is lightweight and can be integrated into existing systems without making significant changes. This makes it an ideal choice for a wide range of heat dissipation requirements.
The specific data is subject to PDF, and the above content is for reference