510-9U Allicdata Electronics
Allicdata Part #:

345-1202-ND

Manufacturer Part#:

510-9U

Price: $ 62.08
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK FOR PWR MOD/IGBT/RELAY
More Detail: Heat Sink Power Modules Aluminum Top Mount
DataSheet: 510-9U datasheet510-9U Datasheet/PDF
Quantity: 32
1 +: $ 56.42910
10 +: $ 52.90490
25 +: $ 49.37810
50 +: $ 47.61460
100 +: $ 45.85110
Stock 32Can Ship Immediately
$ 62.08
Specifications
Series: 510
Part Status: Active
Type: Top Mount
Package Cooled: Power Modules
Attachment Method: Adhesive
Shape: Rectangular, Fins
Length: 9.000" (228.60mm)
Width: 7.380" (187.45mm)
Diameter: --
Height Off Base (Height of Fin): 3.136" (79.65mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 0.29°C/W
Material: Aluminum
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal or heat sinks are devices which are used to dissipate heat from a given object. In this regard, the 510-9U thermal heat sink is an ideal choice for industrial and commercial applications as it is designed to efficiently dissipate the heat generated during the operation of a number of electronic components such as CPUs, video cards, power amplifiers, and computer components. To provide a thorough understanding of the features and working principle of this thermal heat sink, let’s discuss its application field and working principle.

The 510-9U thermal heat sink is made of resilient aluminium and is designed to provide maximum cooling capacity for a variety of electronic components. It is designed in such a way that it can be installed easily and securely without the need for any extra tools or accessories. Its lightweight and robust construction allows for flexibility and easy installation in limited spaces. Additionally, the aluminium case of the 510-9U facilitates highly effective heat dissipation, making it an ideal choice for any application where high levels of heat dissipation are required. This device is capable of operating efficiently within a wide range of temperature conditions, which makes it suitable for various operations.

The 510-9U thermal heat sink works on the principle of heat transfer through convection. When the heat sink is installed on an electronic component, hot air is released from the component and the heat sink absorbs this hot air. This hot air is then dissipated and replaced by cooler air from the environment outside. This cool air moves through tiny passages in the heat sink, which significantly reduces the temperature of the air passing through them. The cooler air is then dissipated, taking all the heat away from the component and providing cooling to it.

In terms of application field, the 510-9U thermal heat sink is ideal for a number of applications. It can be used in consumer electronics, medical products, and telecommunications. It is also suitable for industrial applications such as those found in the computer and semiconductor industries. It is also useful for sensitive electronic suites, such as those used in analytics, gaming, and control applications. Additionally, this product is highly beneficial for data logging and monitoring purposes as it efficiently dissipates heat.

In conclusion, the 510-9U thermal heat sink is an ideal choice for dissipating heat efficiently in a variety of environments, and is suitable for a number of industries and applications. It is lightweight, robust, and designed in such a way that it can be installed easily and securely without extra tools or accessories. Moreover, it works on the principle of heat transfer through convection, which makes it highly efficient in dissipating heat. All of these features make this product an ideal pick for industries and applications which require efficient heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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