| Allicdata Part #: | 345-1204-ND |
| Manufacturer Part#: |
511-12U |
| Price: | $ 54.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK FOR PWR MOD/IGBT/RELAY |
| More Detail: | Heat Sink Power Modules Aluminum Top Mount |
| DataSheet: |  511-12U Datasheet/PDF |
| Quantity: | 22 |
| 1 +: | $ 49.38570 |
| 10 +: | $ 46.30060 |
| 25 +: | $ 43.21370 |
| 50 +: | $ 41.67040 |
| 100 +: | $ 40.12690 |
| Series: | 511 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Power Modules |
| Attachment Method: | Adhesive |
| Shape: | Rectangular, Fins |
| Length: | 12.000" (304.80mm) |
| Width: | 5.210" (132.33mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 2.410" (61.21mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 0.45°C/W |
| Material: | Aluminum |
| Material Finish: | -- |
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Thermal management is extremely important when it comes to electronic devices. Heat buildup can cause components to fail, or even create a dangerous situation. Heat sinks are one of the most common and effective solutions to keep electronic components in a safe temperature range. The 511-12U is a typical heat sink designed to help reduce and dissipate the heat generated in certain applications. This article will discuss the 511-12U\'s application fields and working principle.
Applications of 511-12U
The 511-12U can be used in many applications including power supplies, rectifiers, motor controllers, and semiconductor devices. It is designed to provide maximum heat transfer from active devices, and can also help to increase life expectancy and silent operation. It is a classic low profile, high performance, open fin heat sink which can be used with a variety of cooling fans.
The 511-12U is particularly suitable for working with power transistors, linear power amplifiers and high power voltage converters. It is designed to efficiently pull the heat away from the embedded components to keep them cool, making it ideal for power circuitry. Additionally, the 511-12U can be used with either leaded or surface mount components, allowing for a wide range of applications.
Working Principle of 511-12U
The 511-12U is designed to pull heat away from active components as quickly as possible. This is done by increasing the surface area for heat to be dissipated, as well as by utilizing a thermal compound between the heat sink and the components. The open fin design of the 511-12U also helps to increase the air circulation. This air circulation helps to remove the heat generated by the device by convection, or the natural movement of air.
The 511-12U can be used in conjunction with an additional cooling fan. The fan helps to improve the air circulation and further increases the heat transfer rate, providing an extra layer of protection for the components. A fan can also help to reduce the operating temperature of the device, allowing for more efficient operation.
Conclusion
The 511-12U is an effective heat sink that can be used in a variety of applications. Its low profile design and open fin design allow for efficient heat transfer, making it an ideal choice for electronic components. With the addition of a cooling fan, the 511-12U is an excellent choice for keeping components within a safe temperature range.
The specific data is subject to PDF, and the above content is for reference