511-9M Allicdata Electronics
Allicdata Part #:

345-1209-ND

Manufacturer Part#:

511-9M

Price: $ 51.57
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK FOR PWR MOD/IGBT/RELAY
More Detail: Heat Sink Power Modules Aluminum Top Mount
DataSheet: 511-9M datasheet511-9M Datasheet/PDF
Quantity: 23
1 +: $ 46.88460
10 +: $ 43.95260
25 +: $ 41.02230
50 +: $ 39.55720
100 +: $ 38.09210
Stock 23Can Ship Immediately
$ 51.57
Specifications
Series: 511
Part Status: Active
Type: Top Mount
Package Cooled: Power Modules
Attachment Method: Adhesive
Shape: Rectangular, Fins
Length: 9.000" (228.60mm)
Width: 5.210" (132.33mm)
Diameter: --
Height Off Base (Height of Fin): 2.350" (59.69mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 0.56°C/W
Material: Aluminum
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksHeat sinks are devices which help to maintain the temperature of a system at desirable levels. They’re vital for any system that has higher power requirements, otherwise the components can become damaged due to overheating. The 511-9M is a type of heat sink that, due to its design, is able to cool a wide range of environments with ease. So, let’s take a look at the 511-9M application field and its working principle.The 511-9M heat sink is most commonly used in electronics and computers. It is particularly popular because its design allows it to be placed directly onto the component, making it simpler and quicker to install. The 511-9M is also sometimes used in industrial and medical applications, due to its excellent performance and robust design.The 511-9M is designed to dissipate heat quickly and effectively, and is typically composed of aluminum material. This is important as aluminum is an excellent conductor of heat, and helps to effectively distribute the heat away from the component and into the surrounding environment.The 511-9M is designed with a series of fins, which are spaced at regular intervals on its surface. These fins increase the surface area of the heat sink, allowing more area to be exposed to the surrounding environment. This is important because it means more heat will be able to escape from the component, rather than staying in the system.The fins on the 511-9M also play a role in helping the heat sink to distribute heat more efficiently. As the air passes through the fins, it takes the heat with it, which meanders throughout the surrounding area or is blown away from the system. The larger the number of fins on a heat sink, the better it will be able to disperse heat and keep a system running at the correct temperature.In order to ensure the 511-9M is effective, it’s important to mount it correctly. If it is mounted too closely to a component, it’s possible that the heat generated could accumulate, leading to the component overheating. It’s also important to take into account the environment in which the 511-9M will be used. If it’s being used in a very cold environment, it’ll be important to have a large number of fins, as this will help the heat sink to transfer its heat efficiently.The 511-9M is an excellent choice for many applications due to its ability to keep components working at the correct temperature. The proper selection of components, installation of the 511-9M, and above all, its flexible design, ensures that the 511-9M is suitable for use in a variety of different scenarios. So, whether you’re looking for a heat sink to cool your PC or a medical or industrial system, the 511-9M is certainly an excellent choice.

The specific data is subject to PDF, and the above content is for reference

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