51449-XX001 Allicdata Electronics
Allicdata Part #:

51449-XX001-ND

Manufacturer Part#:

51449-XX001

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: HDR PWRBLADE
More Detail: N/A
DataSheet: 51449-XX001 datasheet51449-XX001 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: HPC™
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Receptacle, Female Sockets
Connector Style: --
Number of Positions: 57
Number of Positions Loaded: 56
Pitch: 0.100" (2.54mm)
Number of Rows: 4
Number of Columns: 14
Mounting Type: Through Hole, Right Angle
Termination: Solder
Contact Layout, Typical: 56 Signal, 1 Coax
Features: Mating Guide
Contact Finish: --
Contact Finish Thickness: --
Color: Black
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: --
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Backplane Connectors - Specialized are a specialized type of interconnection technology used to connect electronic equipment axially in order to form a distributed system. The 51449-XX001 backplane connector is a medium-sized and reliable backplane solution for prototyping applications and developing system architectures and distributed systems.

The 51449-XX001 backplane connector offers a larger and more robust product portfolio compared to many other backplane solutions. It supports both serial and parallel connections, allowing for easy transfer of data between different types of systems, as well as scalability or expansion options.

The 51449-XX001 is used for a variety of applications, such as prototyping, system architecture development, distributed systems, embedded systems, and networking. It is especially popular in embedded system development due to its high data transmission rates and efficient signal routing. Additionally, it is well-suited for distributed systems due to its high speed, versatility, and simple connecting structure.

The working principle of the 51449-XX001 is fairly straightforward. It consists of two main components: a backplane and a connector stack. The backplane serves to hold the connector stack, which is typically comprised of two or more boards connected in parallel. The backplane includes an array of pins, and the connector stack includes receptacles that mate with the pins. These receptacles are typically made up of plated or gold-plated pins and sockets on each board.

When power is supplied to the backplane and the connector stack, a direct connection is made between the two components. This connection, known as a “hot swap”, allows for an immediate connection of data between the components without the need to shut down the system. Additionally, the backplane can be used to power additional electronic components connected to the connector stack.

The 51449-XX001 backplane connector is designed to offer superior signal quality and reliability, while simultaneously allowing for quick and efficient data transfer. As a result, it is a popular choice for embedded system development, particularly when high performance and scalability are desired. Furthermore, the backplane connector provides for a high level of customization, making it an ideal choice for applications requiring custom solutions and/or modifications.

In summary, the 51449-XX001 backplane connector is an advanced interconnection technology used for high performance and scalability in embedded system development. Its simple connecting structure and high speed data transfer and routing capabilities make it an ideal choice for a variety of applications, including system architecture development, distributed systems, networking, and other related applications.

The specific data is subject to PDF, and the above content is for reference

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