51720-10410004AALF

The 51720-10410004AALF is a specialized interconnect technology which is employed to facilitate new advances in the increased utilization of backplane connectors. This technology is a great asset to those wishing to make use of the increasing number of high-speed applications associated with the use of backplane connectors. It is highly reliable, and provides excellent electrical performance characteristics.

This unit has a mature design, and its applications field is directly derived from that. This connector is used for a variety of specialized high speed interconnect requirements, which include: Ethernet speeds up to 40 Gbps, Infiniband networks, and Fibre Channel up to 8 Gbps, but may also include other protocols.

The 51720-10410004AALF presents several unique design features which improves the signal integrity and helps to provide a reliable connection throughout the entire network. This unit utilizes a high density backplane pattern that is designed to provide more than enough space for all interconnects. The backplane itself is constructed using copper-clad aluminum, and its backplane connector contacts are all gold-plated. This allows for maximum signal integrity of both data and power, while ensuring a strong and secure connection.

The working principle of the 51720-10410004AALF is relatively simple. The connector’s contacts are contacted by either a male or a female contact of the mating system. The contact pad is then pushed down onto the corresponding contact pad on the receiving device. As the pads are pushed together, a gold plating on the pads helps to provide a reliable electrical connection and ensure a strong and durable connection.

In addition to the contact pads, the connector also features an array of shielding features which help to reduce EMI, cross-talk, and other types of noise. The shielding also helps to extend the lifetime of the connector, allowing it to maintain its electrical performance characteristics over time.

Overall, the 51720-10410004AALF is an impressive interconnect technology that is gaining more attention as the need for high-speed technologies grows. Its high-density backplane is designed to handle a variety of specialized high-speed protocols, while its gold plated contact pads and advanced shielding work together to create a long-lasting and reliable connection. This technology enables the development of advanced backplane connectors for a variety of applications, making it a great asset to most any organization looking to make use of the latest advances in interconnect technology.