51727-10900000A0LF

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Backplane connectors are an essential part of electronic systems, providing connections between the PCBs and other components to allow signal transfer and communication. Specialized backplane connectors, such as the 51727-10900000A0LF, provide extra benefits and are specifically designed for use in certain applications which require a more reliable and innovative solution. In this article, we will look at the application field and working principle of the 51727-10900000A0LF.

Application Field

The 51727-10900000A0LF is a high speed backplane connector which is designed for use in mobile device applications. It offers enhanced signal integrity and robust performance even in the harshest of conditions. The connector is designed to meet the stringent requirements of 4G and 5G wireless communication systems, making it an ideal solution for applications in cell phone base stations and distributed antenna systems (DAS), as well as industrial IoT and automotive systems. In these applications, the high speed communication requirements and complex signal pathways often require robust and reliable connectors to ensure consistent performance.

The 51727-10900000A0LF is also designed for use in high speed computing applications such as servers, storage, HPC and blade systems. The connector can support data transmission speeds up to 5 Gbps and is compatible with standard zoning architectures to provide improved signal integrity and greater storage compatibility. Furthermore, the connector is compliant with the SFF-8654 specification for high speed, high density backplane environments and supports the edge-card connection for major rack solutions.

Working Principle

The 51727-10900000A0LF is an advanced backplane connector which provides excellent signal integrity and enhanced performance in a range of applications. The primary components of the connector consist of two inline columns of high speed contacts and a press-fit cut-out. The contact columns consist of several rows of rugged, high-performance contacts which can support data transmission speeds up to 5 Gbps. The contacts are made from high quality materials and come with a gold-plated finish. The press-fit feature ensures a secure connection between the contacts and the mating component, reducing the risk of signal interference or damage due to physical stress.

The 51727-10900000A0LF also features an integrated EMI/RF shield which further reduces the risk of signal interference or damage due to physical stress. The shield is made from high-grade metal and is designed to reduce electromagnetic interference, radio frequency interference and crosstalk between high-speed data streams. The connector also comes with a dedicated grounding pin which is designed to provide reliable and secure grounding for the connector and its associated components.

In addition to the excellent signal integrity and enhanced performance, the 51727-10900000A0LF also offers improved thermal stability. This is achieved by the use of a thermal conductive dielectric material, which helps to dissipate heat from the connectors and provides better heat dissipation capability. The connector also features a unique press-fit clamping mechanism which helps to secure the contact columns and protects the contact points from excessive wear.

The 51727-10900000A0LF is a versatile and reliable backplane connector which is designed for a range of applications, including mobile device and high speed computing applications. It has been designed to provide exceptional signal integrity and reliable performance under the harshest of conditions. The connector is compliant with the SFF-8654 specification, ensuring it can be used with a wide range of rack solutions, and features an integrated EMI/RF shield, as well as a press-fit clamping mechanism which helps to secure the contacts. The thermal conductive dielectric material further enhances the connector’s performance by providing improved thermal stability.

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