51730-007LF

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51730-007LF is a backplane connector developed by Molex which has been designed for high-density signal applications. It is commonly used in telecom equipment, networking, and data storage applications. The design of this connector offers excellent performance in high-speed applications, with a maximum data rate of up to 10 Gbp/s. It is also highly reliable, with a three-level mated retention system which offers superior vibration and shock resistance.

The 51730-007LF is a specialized type of backplane connector, specifically designed for use in high-density applications. Its design incorporates two rows of vertical pins which face each other across a gap, allowing for a significant increase in the number of pins that can be used in a given space. The pins are lined with dielectric material to ensure excellent insulation and reduce crosstalk between signals. The pins are arranged with uniform spacing, which allows for high-density connections in a wide range of applications.

The working principle of the 51730-007LF backplane connector is fairly straightforward. The connector has two rows of pins which are arranged in a uniform pattern. The pins are lined with dielectric material, which helps to ensure a good level of insulation between each pin. When the connector is mated, the pins of each side are inserted into the corresponding holes of the other side, making a secure connection. The three-level mated retention system helps to provide a secure connection, and also offers excellent shock and vibration resistance.

The 51730-007LF backplane connector has been designed to offer superior performance in high-density applications. Its uniform pin pattern allows for a high number of connections in a given space, while its three-level mated retention system ensures a secure and reliable connection. In addition, its dielectric lining helps to minimize crosstalk between the signals, and its high data rate makes it suitable for use in high-speed applications.

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