51732-021LF

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Backplane Connectors - Specialized

Backplane connectors are specialized in some applications, and one example is the 51732-021LF. This type of backplane connector is designed to meet an array of requirements in the data storage, data backup and other IT industries. It is especially applicable to systems with low reload time, high performance, and high reliability.

Application Field

The 51732-021LF backplane connector is optimized for applications in the data storage and data backup arena. It is an ideal choice for the Storage Area Network (SAN) server and storage systems, Direct Attached Storage (DAS) and Network Attached Storage (NAS) systems, data center and cloud computing networks, and other applications that require high performance, high reliability, and low reloading time.

Working Principle

The 51732-021LF backplane connector uses a special interconnect system that allows server boards direct physical contact with the connector. The connector has a specialized contact pad layout, which enables it to transfer data and power faster and more reliably than other backplane connectors. It also features a PCB array that eliminates the need to use conventional board-to-board connectors.

The 51732-021LF backplane connector utilizes a signal configuration that attenuates Alien Crosstalk, making it suitable for use in high density equipment and enabling it to transfer data faster than ever before. The connector is designed using impedance-controlled materials, which helps reduce crosstalk caused by mismatched signal impedance in the differential pairs.

The 51732-021LF backplane connecter uses an exclusive electro-deposition surface coating process that offers superior adhesion resistance, which helps in low reload time. The connector also benefits from the application of low insertion forces combined with high mating and unmating forces, which make them suitable for ultra-reliable servers or systems.

In conclusion, the 51732-021LF backplane connector is designed to meet an array of requirements for data storage, data backup and other IT applications. It utilizes a specialized interconnect system, signal configuration, PCB array, and electro-deposition surface coating process in order to provide faster data transfer rates, increased reliability, and reduced reload time.

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