51732-003LF

51732-003LF Application Field and Working Principle

The 51732-003LF is a specialized backplane connector. It has become a popular choice among designers for connecting modulatized backplanes and pcbs in tight spaces due to its small size and low profile. The 51732-003LF offers a robust connection with a maximum height of only 1.8mm.

The 51732-003LF is also known as an IDC (Insulation Displacement Connector). The IDC method of connecting is well-suited for backplane applications as it eliminates the need for soldering, and is quick and straightforward to install. The connection is maintained by the insulation displacement contacts (IDC) using a ‘blade’ to cut through the insulation and make contact with the conductors. This cutting blade provides a robust connection which can withstand multiple plugging and unplugging operations.

The 51732-003LF has a total of 64 pins with 8-row x 9-column distribution. It can accept terminations in the form of wire-wrap, solder, crimp or IDC. The contact material is phosphor bronze with a matting pin finish (gold plate also available). The insulation material is liquid crystal polymer (LCP).

The working principle of a 51732-003LF backplane connector is quite simple and user friendly. All that is needed is to align the contact pins with the conductors on the backplane. The conductor housing flap on the end of the connector is then closed, causing the contact pins to deflect and pierce the insulation on the conductors. The resulting connection is robust, reliable and can handle large amounts of transient/dynamic power.

The 51732-003LF connector is an ideal choice for use in modulatized backplanes as it provides an easy and cost effective way to connect different modules. It is suitable for use in the networking, telecommunications, industrial automation and control, military and aerospace industries.