51732-082LF Allicdata Electronics
Allicdata Part #:

51732-082LF-ND

Manufacturer Part#:

51732-082LF

Price: $ 2.56
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: R/A HDR PWRBLADE
More Detail: N/A
DataSheet: 51732-082LF datasheet51732-082LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
660 +: $ 2.31690
Stock 1000Can Ship Immediately
$ 2.56
Specifications
Series: PwrBlade®
Packaging: --
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Header, Male Pins and Blades
Connector Style: Blade Power
Number of Positions: --
Number of Positions Loaded: --
Pitch: --
Number of Rows: --
Number of Columns: --
Mounting Type: --
Termination: --
Contact Layout, Typical: --
Features: --
Contact Finish: Gold or Gold, GXT™
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: -20°C ~ 105°C
Voltage Rating: --
Description

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Backplane Connectors have become integral components in modern multiport systems because of their ability to easily provide flexible signals between boards. Specialized Backplane Connectors like 51732-082LF offer the ability to support various industry standard protocols, such as PCI Express, SAS, SATA, and USB, as well as other specialized high-speed protocols. In this article we will look at the application field and working principle of the 51732-082LF.

The 51732-082LF is designed for use in high-performance, high-density backplane interconnections that require high-speed signaling. It is suitable in a variety of industrial and enterprise applications, including network switches, RAID controllers, communication systems, computer server and storage systems, high-end desktops, and other data transmission or storage devices. The connector provides reliable solutions to satisfy the growing demand of bandwidth and data combination between electronic equipment and/or multicontact components while also reducing system power consumption.

The connector supports through-hole and right-angle mounting with press-fit and welded construction to seamlessly meet a range of board-to-board mounting problems. The connector provides rugged shielding to ensure a secure connection and basic protection in case of mechanical shock or vibrations. The 51732-082LF is optimized for high-frequency applications and has an operating frequency of up to 10 GHz. It is designed to maximize signal integrity and signal stability in high-speed backplane and board-to-board interconnections.

The 51732-082LF is a high-speed, low-power specialized backplane connector. It uses two rows of 40 positions to maximize power efficiency and minimize crosstalk, resulting in improved signal integrity and faster signal transfer. These connectors use one-piece contact and a single beam design to ensure precise mating alignment and are rated for up to 2A at 30V per contact. The construction and design of this specialized connector allows for reliable, low-power and high-speed connections between components.

The working principle of the 51732-082LF is based on a snap-lock mating mechanism. This principle provides a secure and reliable connection by utilizing two precision-molded lever arms that provide latching force. The latching force ensures that the connection is properly engaged each time and is strong enough to withstand the shock and vibration associated with industrial applications. Additionally, the latching force helps to ensure signal integrity and prevents accidental disconnection during operation.

The 51732-082LF is a high-performance specialized backplane connector designed for use in a wide range of industrial and enterprise applications. This connector features rugged shielding, high-frequency signal transmission, and a snap-lock mating mechanism that guarantees secure connections and data integrity. It is designed to meet the rising demand of bandwidth and data combination between electronic equipment and/or multicontact components. It is optimized for high-speed, low-power data transmission, making it the ideal solution for applications that require maximum signal bandwidth and data transfer rates.

The specific data is subject to PDF, and the above content is for reference

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