51772-007LF

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The 51772-007LF is a backplane connector designed for high-speed signaling applications. It features a z-axis compliant design that minimizes impedance mismatch and crosstalk. It has a dual-sided pad design that facilitates mating and dismounting. The connector is available in a variety of sizes, including a 7-position 0.025” (0.64mm) pitch version for high-density applications.

The 51772-007LF is optimized for use with Circuit Board (PCB) based systems. It is designed to provide maximum signal integrity when used with high speed multi-gigabit data communications applications. Its design also ensures robustness in vibration and shock environments. The 51772-007LF is also compatible with hot air rework (HAR) processes.

The 51772-007LF is ideal for applications such as networking, data processing, media, storage, and consumer electronics. It can be used in any application requiring the reliable transmission of high-speed, low-latency, data signals. It is also well-suited for use in mobile network infrastructures, as well as in embedded, communication, and entertainment systems.

The 51772-007LF has a number of features that allow it to stand out in its field. It has a 2-piece terminal and housing design, with an integrated wire-to-board locking system. This design allows the connector to easily mate with other devices and also prevents accidental disconnection. Additionally, the 51772-007LF has patented screw-mold contact terminals on both sides, providing reliable electrical and mechanical connections.

Moreover, the 51772-007LF\'s design includes a high degree of vibration and shock resistance, making it suitable for on-board applications. The connector\'s dual-sided pad design also assists in making tight connections and reduces the need for extra adapters and tooling for installation. The 51772-007LF is also capable of withstanding temperatures between -40 to +105°C.

The 51772-007LF is a single port connection system that has a specialized two-piece terminal and housing design, allowing for maximum signal integrity and robustness in vibration and shock environments. The dual-sided pad design ensures reliable electrical and mechanical connections, and the integrated wire-to-board locking system guarantees secure connections. The 51772-007LF is suitable for high-speed, low-latency, data signal transmission. It is ideal for networking, storage, media, and consumer electronics applications.

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