5179447-1 Allicdata Electronics

5179447-1 Connectors, Interconnects

Allicdata Part #:

5179447-1-ND

Manufacturer Part#:

5179447-1

Price: $ 8.60
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: HDR CONN ASSY Z-PACK J-II POWER
More Detail: 6 (Power) Position Header, Male Pins Connector 0.1...
DataSheet: 5179447-1 datasheet5179447-1 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1320 +: $ 7.82145
Stock 1000Can Ship Immediately
$ 8.6
Specifications
Series: Z-PACK
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: --
Number of Positions: 6 (Power)
Number of Positions Loaded: All
Pitch: 0.150" (3.81mm)
Number of Rows: 2
Mounting Type: Through Hole
Termination: Solder
Connector Usage: --
Contact Finish: Gold
Contact Finish Thickness: 20.0µin (0.51µm)
Current Rating: 5A
Voltage Rating: --
Operating Temperature: --
Features: --
Description

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Backplane connectors are an important and integral part of the design of data centers and telecommunications networks. They are used to ensure the reliable and safe transmission of data and power from one location to another. The 5179447-1 backplane connector is a type of hard metric, standard backplane connector, and is specially designed to meet the data transmission requirements of modern data centers and telecommunications networks. In this article, we’ll discuss the application field and the working principle of the 5179447-1 backplane connector.

The 5179447-1 backplane connector is a popular choice for high speed data transmission applications. It is typically used in high-end industrial automation systems, data centers, and telecommunications networks. This type of backplane connector is designed with standard footprint specifications and offers the performance of a point-to-point connection over a backplane connector. The footprint and design of the 5179447-1 allows for easy installation and maintenance, as well as offering a safe connection to devices on the backplane. It is also capable of supporting the highest data rates and providing EMI shielding without compromising signal integrity.

The working principle of the 5179447-1 backplane connector is based on its design and construction. It utilizes a mesh of copper lines that are wired across the backplane. This configuration helps to reduce the overall resistance of the connection and improves the flow of data across the backplane. The other components of the 5179447-1 include a shielded backplane interface, a signal ground conductor, and an outer dielectric material. All of these components work together to form a secure connection that enables the transfer of data with minimal interference or loss of signal.

The 5179447-1 also offers a number of features that are beneficial for use in high speed data transmission applications. First, it can support higher data rates than similar backplane connectors. It also provides a level of EMI shielding that other backplane connectors cannot match. This helps to ensure that the signal transmission is not affected by external interference and that data is always transferred securely. Finally, the 5179447-1 comes with an outer dielectric material, which helps to ensure that the signal remains within the connector and is not compromised during installation or removal.

Overall, the 5179447-1 backplane connector is an ideal choice for data centers and telecommunications networks that require high speed data transmission. Its standard footprint helps to simplify installation and maintenance, while its EMI shielding ensures that data is always transferred reliably. Additionally, its outer dielectric material provides added protection and security for the connected components. With all of these features, the 5179447-1 backplane connector is an efficient and reliable choice for high speed data transmission applications.

The specific data is subject to PDF, and the above content is for reference

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