51939-306LF

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Backplane connectors are an essential part of the electrical and telecommunications industries. They are used to provide an electrical link between two or more devices or components, allowing them to exchange data and signals. The 51939-306LF is one type of backplane connector and is suitable for various applications. This article will discuss the application field and working principle of the 51939-306LF.

Application Field

The 51939-306LF is a high-speed backplane connector which is designed to be extremely reliable in applications requiring high frequency data transmission. It is suitable for use in various industrial applications, including medical imaging, computer technology, military and aerospace, broadcasting, and telecommunication systems. It is also suitable for use in a range of backplane systems.

Working Principle

A backplane connector is essentially a device which connects two or more components together to allow them to exchange data and signals. The 51939-306LF backplane connector is based on the 2-mm pitch and 12-layer technology. The connectors are embedded with two rows of signal pins, each with six pins which are connected with a stackable contact system. When the connector is mated, the contact system provides a reliable and secure connection.

The design of this connector supports high speed data transmission of up to 28 Gbps. It also has superior performance against EMI, ensuring that signals remain reliable even under harsh environmental conditions. Furthermore, the 51939-306LF is an ultra-low profile connector which ensures a tight fit in space-constrained environments. This makes it well suited for applications in which space is at a premium.

Conclusion

The 51939-306LF is an advanced backplane connector which is suitable for use in a range of industrial applications which require high speed data transmission. The connector is designed to be extremely reliable and is capable of meeting the demands of a wide range of harsh environmental conditions. Furthermore, its ultra-low profile ensures that it can be fitted into space-constrained environments. This makes it a great choice for applications such as medical imaging, computer technology, and telecommunication systems.

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