51940-237LF

Series:	PwrBlade®
Packaging:	Tray
Lead Free Status / RoHS Status:	--
Part Status:	Active
Moisture Sensitivity Level (MSL):	--
Connector Usage:	--
Connector Type:	Receptacle, Female Sockets and Blade Sockets
Connector Style:	Blade Power
Number of Positions:	29
Number of Positions Loaded:	26
Pitch:	0.100" (2.54mm)
Number of Rows:	4
Number of Columns:	--
Mounting Type:	Through Hole
Termination:	Solder
Contact Layout, Typical:	20 Signal, 9 Power
Features:	Board Lock, Guide Pin
Contact Finish:	Gold or Gold, GXT™
Contact Finish Thickness:	30.0µin (0.76µm)
Color:	Black
Current Rating:	--
Material Flammability Rating:	UL94 V-0
Operating Temperature:	-20°C ~ 105°C
Voltage Rating:	--

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Introduction

51940-237LF are Backplane Connectors that are specialized for certain applications and have their own separate working principles. In this article, we will have an in-depth discussion of the application field and working principle of this particular type of special connector. We will also provide an overview of its features, advantages, and other key considerations.

Application Field

The 51940-237LF is specifically designed for applications which require a higher level of precision and a greater amount of data than a basic backplane connector can provide. It has been designed for high-density data transmission, high-speed data transmission, multi-boarding, and for use in high-performance dual-board and multi-board system designs. Its superior performance is achieved by the use of specially designed and manufactured features that make it suitable for a wide variety of high-performance applications. The 51940-237LF features high contact density, allowing for a significant increase in data transmission speeds, while at the same time reducing the board area required for installation. Additionally, its low-loss transmission capabilities result in an improved signal integrity. Low transmission losses reduce the amount of power required for data transmission, leading to longer battery life for the system. The 51940-237LF can also be used for power, ground, and signal transfer.

Working Principle

The 51940-237LF is designed to provide data transmission speeds of up to 200Mbps. It is a differential 8-pin connector, with pins arranged in two pairs (ground and signal). The signal contacts are made of high-precision molybdenum, which is used for its superior heat dissipation and wear resistance. The connector is designed to provide superior signal integrity and low power losses. It uses a combination of connector and PCB structure to optimize the signal transfer path and reduce transmission losses. The design of the connector is also optimized to reduce the crosstalk that can occur when multiple data pairs are being transmitted through the same connector. The connector also features an integrated grounding system that eliminates any electrical ground noise.

Features and Advantages

The 51940-237LF offers a variety of features that make it a superior backplane connector. It is designed to provide superior signal integrity and enhanced thermal performance. It provides low insertion and removal forces, making for easy installation and removal. The connector also features an integrated EMI shield that protects against electromagnetic interference and crosstalk.The 51940-237LF also offers a number of benefits, such as improved data transfer rates, reduced transmission losses, and longer battery life. Additionally, it is designed to provide higher levels of reliability than standard backplane connectors. The connector also provides a higher level of insulation and protection against electrical failure.

Conclusion

The 51940-237LF is a specialized backplane connector that is designed to provide superior signal integrity and reliable data transmission. Its application field includes high-speed data transfer, multi-boarding, and high-performance dual-board and multi-board system designs. Its working principle is based on a combination of connector and PCB structure that optimizes signal transfer and reduces transmission losses. Furthermore, its features and advantages include improved data transfer rates, reduced transmission losses, enhanced thermal performance, and a high level of reliability.

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