51940-408LF

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Backplane connectors are the structural linkage of electronics systems. They are used to a few diverse applications, but specialized interconnect solutions such as the 51940-408LF are needed when the level of complexity is taken up a notch.

Knowing the field of application as well as the working principle of the 51940-408LF helps with the integration of an electronics system into an existing or new system.

Application Field

The 51940-408LF backplane connector is used in high-density board-to-board applications and for interconnecting multiple boards in an electronics system. It is designed for dedicated signaling and power applications in communications, datacom, medical, test and industrial automation systems.

This backplane solution has a pitch of 0.8mm and utilizes shrouded SMT/SMD, IDC or GPC contacts. It is rated for 5A and offers a working voltage rating of 400V AC. These features combined provide excellent signal integrity and reliable power transmission when used in a robust and efficient system.

The 51940-408LF backplane connector is available in a variety of header designs, from 2 to 30 positions. All versions features an optional ground shield for improved system shielding and low electromagnetic interference (EMI).

Working Principle

The 51940-408LF is an intelligent backplane connector. It features unique wiring style manual spin locking for superior cable strain relief and latch locking retention for secure mating. This makes it suitable for use in a broad array of industrial applications.

The 51940-408LF contact and wire configuration has four pins installed, arranged in a “T” pattern. This provides for a combination of different signal types, from high speed signals to ground signals, as each pin can be converted from one type to another. The signal integrity is enhanced by PoP semi-rigid construction, ensuring superior coaxial performance.

To ensure a high level of system robustness, the 51940-408LF utilizes an integrated bracket retention clip for robust durability during mating and unmating cycles. The contact springs are also designed to reduce stress on the conductors and decrease lead bending across the interface. This helps reduce the impact of differential matings on system performance.

The 51940-408LF is a specialized solution for high-density interconnect applications. With its 0.8mm pitch, low-profile design, and easy-to-configure T-style contact arrangement, the 51940-408LF is perfect for tight spaces where electrical connection and reliability are of utmost importance. It offers excellent signal integrity, rugged durability, low EMI and low contact resistance, making it the ideal connector for industrial IoT applications and smart electronics systems.

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