5223081-2

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Backplane Connectors play a key role in the construction of electronic devices by providing secure connections and reliable communication to circuits or other devices. The 5223081-2 is one such type of backplane connector, designed for high-density applications. This section will provide an overview of the 5223081-2 with respect to its application field and working principle.

Application Field

The 5223081-2 has been developed to provide a secure and reliable connection for applications with high power and data requirements. It is especially suitable for applications which require high-density connectors, such as those found in military and aerospace equipment, telecom infrastructure, medical electronics, and industrial equipment. The particular application requires an appropriately sized 5223081-2 connector, depending on the size of the backplane. The 5223081-2 is available in various pin and contact arrangements, making it ideal for tailored application solutions.

Working Principle

The 5223081-2 is a two-piece connector, consisting of a modular housing with an integrated insulation displacement contact (IDC) and a receptacle for the modular housing. The IDC acts as the connector’s electrical contactor and is made up of an insulation base material with interlocking contact channels. The connector housing fits into the backplane and compresses against the IDC contact structures. This ensures secure and reliable connections between the backplane and the PCB by creating electrical contact without the need for soldering. The contacts are then held in place by the connector’s ‘snap-in’ feature.

The 5223081-2 connector is made up of two layers. The first layer contains the IDC itself, which is held in place by the second layer which consists of the connector’s housing and insulation. This dual-layer design allows for the transmission of higher flow, higher efficiency, and lower profile signals. It also ensures the connector is resistant to high frequency and signal loss, making it suitable for high-density applications.

Conclusion

The 5223081-2 is an ideal solution for applications requiring high-density connections, thanks to its high efficiency and low profile. Its two-layer construction provides reliable electrical contact without the need for soldering, making it suitable for applications with high power and data requirements. The 5223081-2 is available in various pin and contact arrangements, making it ideal for tailored application solutions. As such, this type of backplane connector is a popular choice among engineers looking to create secure, reliable, and high-density connections.

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