| Allicdata Part #: | ATS1117-ND |
| Manufacturer Part#: |
ATS-52230G-C1-R0 |
| Price: | $ 5.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 23MM X 23MM X 12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52230G-C1-R0 Datasheet/PDF |
| Quantity: | 1004 |
| 1 +: | $ 4.66200 |
| 10 +: | $ 4.53537 |
| 25 +: | $ 4.28350 |
| 50 +: | $ 4.03162 |
| 100 +: | $ 3.77962 |
| 250 +: | $ 3.52765 |
| 500 +: | $ 3.27567 |
| 1000 +: | $ 3.21268 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
As an important part of the thermal management of power electronic devices, heat sinks are widely used in industrial automation and communication equipment. In such occasions, ATS-52230G-C1-R0 has been developed as an optimal solution for application in high-power quick-transition circuits. This module is designed to dissipate heat efficiently and provide a reliable thermal management scheme.
The ATS-52230G-C1-R0 is a two-stage high-thermal-conductivity and high-stability heat sink designed for high power short pulse applications. It has an optimized tilt angle of 90 degrees from the base plate and a 17 mm mounting hole for quick installation. It is designed with a patented forced air convection that helps dissipate heat quickly and efficiently. In addition, it’s hexagonal slots for efficient air flow, ensuring the thermal dissipation of power electronic devices is optimal.
This heat sink is specifically designed for cooling high-power quick-transition circuits such as lighting, power conversion, and automation control. Its heat dissipation system ensures the reliability of power electronic products in high temperature and high power environments. ATS-52230G-C1-R0 is a great choice for various applications like medium and high power drivers, high current IGBT gate driver, motor drivers, contactors, etc.
The working principle of the ATS-52230G-C1-R0 heat sink is based on forced air convection. Cool air is drawn in through the hexagonal slots and flows around the heat sink body evenly. The air is exhausted through the top of the sink, thereby taking away the heat from the components. This effectively dissipates the heat of the devices, providing a reliable thermal solution. Additionally, the ATS-52230G-C1-R0 has a unique tilt angle of 90 degrees, which helps dissipate the heat from the components more quickly so that it can be quickly transferred to the air flow.
ATS-52230G-C1-R0 heat sink is an optimal solution for a reliable thermal management scheme. It is highly recommended for applications like medium and high power drivers, high current IGBT gate driver, motor drivers, contactors, etc. Its design maximizes the air flow for quickly dissipating heat from power electronic devices, providing an efficient and stable thermal solution for quick-transition circuits.
The specific data is subject to PDF, and the above content is for reference